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18466. Efficient Industrial Splintering with Advanced Silicon Carbide Technology 
[Feb 28, 2026]
[Feb 28, 2026] Silicon Carbide High Temperature Splintering Furnace and Industrial Furnace industrial equipment Product Description Certification ISO Warranty 1 year Automatic ...
18467. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
18468. 8-Inch Stainless Steel Wafer Frame Dicing Ring for Semiconductor Use [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18469. Advanced Precision Laser Drilling Equipment for Zirconium and Alumina [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
18470. Advanced Laser Wafer Marking System for Precision Depth Control [Feb 28, 2026]
[Feb 28, 2026] High Precision Laser Processing&Depth Control Wafer Laser Marking Machine Product Description Product Features High precision laser processing&depth control Auto sample transfer, high precision positioning Auto ...
18471. China Wholesale Ultra-Shallow Dopant Laser Annealing Equipment for Semiconductor Machine Bsi-CCD ... [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
18472. Advanced Ultra-Shallow UV Dopant Laser Annealing Equipment for Bsi-CCD & Sic Wafers [Feb 28, 2026]
[Feb 28, 2026] Premium-Grade Sic UV Laser Annealing Machine for BSI-CCD Wafers Product Description Shallow Dopant Laser Annealing for BSI-CCD and Advanced Semiconductors In the relentless pursuit of smaller, faster, and more ...
18473. Dry-in/Dry-out (DIDO) Process Chemical Mechanical Polishing Machine System for Wafer Polishing [Feb 28, 2026]
[Feb 28, 2026] Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
18474. Fully Automaric Dry-in/Dry-out CMP Polisher/Tool for Wafer Cleaning System - Horizon300 [Feb 28, 2026]
[Feb 28, 2026] Product Description Fully Automatic CMP Polisher is designed for thin film (dielectric layer) processing, offering user-friendly operation and strong compatibility. By simply changing the polishing head, it can ...
18475. Projection Lithography Machine Suitable for Packaging Micro LED Mems [Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-02 Projection lithography Product advantages 1.High yield 2.Modular design 3.High reliability 4.Suitable for packaging MicroLED MEMS and other processes Wafer Size 200mm Wafer(300mm ...
18476. High-Speed Fiber Laser Engraving Machine for Multiple Uses [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Structure: One-piece, split, vertical, horizontal, etc., for all testers High Reliability, long life fiber laser Max. UPH up to 60K Offline control mode,good ...
18477. High-Precision Laser Processing Equipment for Thin Film Solar Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Parameter Equipment Model HMLA03 Equipment Type Double head double light road Processing area 50x50mm-500x500mm Cut Method Cut head / vibrator Positioning ...
18478. Advanced Hm-6250d 1t-EDI Water System for Industrial Cleaning [Feb 28, 2026]
[Feb 28, 2026] This DI water system: through the quartz sand activated carbon pretreatment system, and then through the first and second RO membrane reverse osmosis, and then through the EDI membrane stack, DI water is produced for ...
18479. 600X600 600X1200mm Acoustic Ceiling Sound-Absorbing Ceiling Tiles [Feb 28, 2026]
[Feb 28, 2026] DEGOFON Stonewool Acousticl Ceilings The base material of Degofon ceiling products is stone wool (resin bonded mineral wool) produced according to the principles of a volcanic eruption. By means of patented ...
18480. 600 X600 Sound Tile Rockwool False Ceiling Tiles [Feb 28, 2026]
[Feb 28, 2026] Acoustic ceiling tiles 600*600mm/1200mm (2X2 2X4 ) Product name: Suspended Modules Ceilings Tile WHITE CEILING TILES The white and elegant DEGOFON acoustic ceiling can meet your needs in any space.Provide ...
