Jiangsu Profile
Product List
18436. High-Performance Sic Laser Annealing System for Wafer Efficiency 
[Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
18437. Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System [Feb 28, 2026]
[Feb 28, 2026] Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Measurement Precision: Current Range Precision Voltage Range Precision 10nA ±(1% + 0.04% FS + ...
18438. High Precision Single Mode Alignment System [Feb 28, 2026]
[Feb 28, 2026] Product Description High-Precision Single-Mode Alignment System Core Functionality An active/passive alignment system designed for sub-micron positional accuracy (typically <0.1 µm) to maximize coupling ...
18439. Tgv High Yield Precision Cutting Laser Drilling Equipment [Feb 28, 2026]
[Feb 28, 2026] Tgv High Yield Precision Cutting Laser Drilling Equipment Product Description TGV High Yield Precision Cutting Laser Drilling Equipment Product Overview This TGV (Through Glass Via) laser drilling equipment is ...
18440. Sic Wafer GaN Substrates Chemical Mechanical Polishing Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other ...
18441. High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry [Feb 28, 2026]
[Feb 28, 2026] Product Description Wafer Handling and Marking System - Technical Overview Key Features Wafer Compatibility Supports 8-12 inch bare wafers (configurable for 2-12 inches via modular options). Adaptable to ...
18442. Advanced Qt-8200 Mixed Signal Tester for Precision Measurements [Feb 28, 2026]
[Feb 28, 2026] Product Description QT-8200 Mixed Signal IC Test System (Hard-Docking) Product description: Application scope: power management; digital consumer; audio; automotive, energy saving and environmental friendly electronics; ...
18443. Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
18444. High-Aspect-Ratio Deep Reactive Ion Etching of Silicon Etcher System [Feb 28, 2026]
[Feb 28, 2026] Deep Reactive Ion etching of Silicon ICP Etcher The ICP Etcher is a high-performance etching equipment designed for precision manufacturing in advanced technology fields, with comprehensive capabilities and flexible ...
18445. Efficient Industrial Splintering with Advanced Silicon Carbide Technology [Feb 28, 2026]
[Feb 28, 2026] Silicon Carbide High Temperature Splintering Furnace and Industrial Furnace industrial equipment Product Description Certification ISO Warranty 1 year Automatic ...
18446. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
18447. 8-Inch Stainless Steel Wafer Frame Dicing Ring for Semiconductor Use [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18448. Advanced Precision Laser Drilling Equipment for Zirconium and Alumina [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
18449. Advanced Laser Wafer Marking System for Precision Depth Control [Feb 28, 2026]
[Feb 28, 2026] High Precision Laser Processing&Depth Control Wafer Laser Marking Machine Product Description Product Features High precision laser processing&depth control Auto sample transfer, high precision positioning Auto ...
18450. China Wholesale Ultra-Shallow Dopant Laser Annealing Equipment for Semiconductor Machine Bsi-CCD ... [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
