Jiangsu Profile
Product List
18451. New Technology Txj1000 Concentric Stranding Machine for Manufacturing Aluminium Stranded Conductors 
[Mar 02, 2026]
[Mar 02, 2026] Product Introduction CONCENTRIC STRANDING LINE for manufacturing ACSR, copper and aluminium stranded conductors The concentric stranding machine is designed specifically for no-back-twist stranding and pressing of ...
18452. High-Performance Vertical Furnace for Sic and Pi Coatings [Mar 02, 2026]
[Mar 02, 2026] Fully Automatic Sic/Pi Composite Film Coating Vertical Furnace equipment manufacturer Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The ...
18453. High-Precision Laser Marking Machine for BGA and LGA Components [Mar 02, 2026]
[Mar 02, 2026] High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning ...
18454. Advanced Laser Debonding Technology for Rapid Industrial Solutions [Mar 02, 2026]
[Mar 02, 2026] Automatic Compensation Laser Debonding/Stripping Machine with Real-Time Monitoring Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding ...
18455. Advanced Electroplating Cleaning Machine for Precision Metal Finishing [Feb 28, 2026]
[Feb 28, 2026] High-Quality Electroplating Cleaning Machine for Electroplating, Plating, Oxidation, Etching and Cleaning Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated ...
18456. High-Performance Sic Laser Annealing System for Wafer Efficiency [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
18457. Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System [Feb 28, 2026]
[Feb 28, 2026] Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Measurement Precision: Current Range Precision Voltage Range Precision 10nA ±(1% + 0.04% FS + ...
18458. High Precision Single Mode Alignment System [Feb 28, 2026]
[Feb 28, 2026] Product Description High-Precision Single-Mode Alignment System Core Functionality An active/passive alignment system designed for sub-micron positional accuracy (typically <0.1 µm) to maximize coupling ...
18459. Tgv High Yield Precision Cutting Laser Drilling Equipment [Feb 28, 2026]
[Feb 28, 2026] Tgv High Yield Precision Cutting Laser Drilling Equipment Product Description TGV High Yield Precision Cutting Laser Drilling Equipment Product Overview This TGV (Through Glass Via) laser drilling equipment is ...
18460. Sic Wafer GaN Substrates Chemical Mechanical Polishing Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other ...
18461. High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry [Feb 28, 2026]
[Feb 28, 2026] Product Description Wafer Handling and Marking System - Technical Overview Key Features Wafer Compatibility Supports 8-12 inch bare wafers (configurable for 2-12 inches via modular options). Adaptable to ...
18462. Advanced Qt-8200 Mixed Signal Tester for Precision Measurements [Feb 28, 2026]
[Feb 28, 2026] Product Description QT-8200 Mixed Signal IC Test System (Hard-Docking) Product description: Application scope: power management; digital consumer; audio; automotive, energy saving and environmental friendly electronics; ...
18463. Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
18464. High-Aspect-Ratio Deep Reactive Ion Etching of Silicon Etcher System [Feb 28, 2026]
[Feb 28, 2026] Deep Reactive Ion etching of Silicon ICP Etcher The ICP Etcher is a high-performance etching equipment designed for precision manufacturing in advanced technology fields, with comprehensive capabilities and flexible ...
18465. Efficient Industrial Splintering with Advanced Silicon Carbide Technology [Feb 28, 2026]
[Feb 28, 2026] Silicon Carbide High Temperature Splintering Furnace and Industrial Furnace industrial equipment Product Description Certification ISO Warranty 1 year Automatic ...
