Jiangsu Profile
Product List
18601. Advanced Automatic Laser Drilling Machine for Glass and Ceramics 
[Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...
18602. Advanced High-Precision Automated Die Bonder for Multi-Chip Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Our high-precision, multi-chip, automated die bonding system designed for advanced semiconductor and microelectronic assembly. It is engineered for flexibility, handling a wide variety of chip ...
18603. High-Precision Gantry Wire Bonder for Diverse Industrial Uses [Dec 13, 2025]
[Dec 13, 2025] Product Description Our high-performance, fully automated wire bonder designed for a wide range of interconnection applications in semiconductor packaging. It is built with a robust long gantry XY system to ...
18604. Advanced Plasma Cleaner for Efficient Wafer Photoresist Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
18605. Advanced Double-Tube Vertical Furnace for Pi Cuer Annealing Process [Dec 13, 2025]
[Dec 13, 2025] Double-Tube Fully Automatic Vertical Furnace for PI Cuer, annealing, alloy Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, ...
18606. Advanced Bsi-CCD Wafer Laser Annealing Equipment for Precision Energy Control [Dec 13, 2025]
[Dec 13, 2025] Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with ...
18607. 6 Inch Wafer Ring Frame for Semiconductor SUS420J2 with Factory Direct Price [Dec 13, 2025]
[Dec 13, 2025] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18608. Premium Fmj Series High-Temperature Furnace for Industrial Applications [Dec 13, 2025]
[Dec 13, 2025] High Quality Fmj Series High-Temperature Box Sintering Furnace Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation ...
18609. High-Precision CCD Wafer Splitting Machine for Sic Semiconductor Chips [Dec 13, 2025]
[Dec 13, 2025] Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...
18610. Dry-in/Dry-out (DIDO) Process Chemical Mechanical Polishing Machine System for Wafer Polishing [Dec 13, 2025]
[Dec 13, 2025] Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
18611. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
18612. Advanced Plasma Asher for Efficient Wafer Glue Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
18613. Manual Semi Automatic Aluminum or Gold Desktop Wire Bonders with Factory Price [Dec 13, 2025]
[Dec 13, 2025] Product Description Himalaya DS Series Manual Desktop Wire Bonder The Himalaya DS Series of manual desktop wire bonders provides a versatile and cost-effective solution for precision interconnection tasks. Engineered ...
18614. Ultra-Fast Picosecond Laser Glass Cutting and Lobing Machine [Dec 13, 2025]
[Dec 13, 2025] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
18615. High End Stable Operations and Profitable Returns Lithography Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description 1900 Series Advanced Lithography Equipment - Overview The 1900 Series is a high-end lithography system designed for advanced semiconductor process production. It is currently installed and in a ...
