Jiangsu Profile
Product List
10906. High-Performance Fireproof Silicone Sealant for Windows & Doors 
[Feb 12, 2026]
[Feb 12, 2026] RUNTAI FIREPROOF WEATHERPROOF SILICONE SEALANT Overview RT-119 is a high-performance, single-component, neutral-cure fireproof silicone sealant designed for industrial and glazing applications. It forms a ...
10907. China Factory Supply Glass Polishing Material High Purity 30% Cerium Oxide Polishing Liquid ... [Feb 12, 2026]
[Feb 12, 2026] Product Description 1.Polishing material 2.Uv resistant application of textiles, ceramics, silica gel, coatings and other materials [Product Features] 1.Good fluidity, not easy to precipitate, can be diluted with ...
10908. Nano Cerium Oxide Dispersion Liquid Cerium Oxide Dispersion Dispersion CEO2 Dispersion 30% Cerium ... [Feb 12, 2026]
[Feb 12, 2026] Product Description 1.Polishing material 2.Uv resistant application of textiles, ceramics, silica gel, coatings and other materials [Product Features] 1.Good fluidity, not easy to precipitate, can be diluted with ...
10909. Nano Cerium Oxide Dispersion Liquid Dispersion CEO2 Dispersion 30% Cerium Oxide Nanoparticlesno ... [Feb 12, 2026]
[Feb 12, 2026] Product Description 1.Polishing material 2.Uv resistant application of textiles, ceramics, silica gel, coatings and other materials [Product Features] 1.Good fluidity, not easy to precipitate, can be diluted with ...
10910. China Raw Material Glass Polishing Material High Purity 30% Cerium Oxide Polishing Liquid ... [Feb 12, 2026]
[Feb 12, 2026] Product Description 1.Polishing material 2.Uv resistant application of textiles, ceramics, silica gel, coatings and other materials [Product Features] 1.Good fluidity, not easy to precipitate, can be diluted with ...
10911. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
10912. Advanced Fully Automatic Die Bonding Machine for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
10913. Advanced Automated Back Grinding Machine for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
10914. Advanced High Efficiency Hmds Pretreatment System for Adhesives [Feb 28, 2026]
[Feb 28, 2026] Product Description Advantages of HMDS pretreatment system: 1. The pretreatment performance is better. Since the HMDS treatment is carried out after several nitrogen replacements, there will be no interference ...
10915. Advanced Smart Laser Debonding System with Real-Time Monitoring [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
10916. Advanced Fully Automatic Semiconductor Molding System with Quick Mold Change [Feb 28, 2026]
[Feb 28, 2026] Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 inch touch screen+touch ...
10917. Advanced High Precision Die Bonder for Semiconductor Packaging [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
10918. Advanced Automated Wafer Film Application and Cleaning Solution for Precision Manufacturing [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
10919. Advanced Precision Wafer Die Bonder with Smart Control Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
10920. Advanced Precision Eutectic Die Bonding Equipment for High-Quality Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for different kinds ...
