Jiangsu Profile
Product List
10876. Automatic Sleeve Labeling Machine / Shrink Sleeve Labeler for Pet Bottles 
[Mar 07, 2026]
[Mar 07, 2026] Product Description This automatic shrink sleeve labeling machine is designed for high-precision application of shrink sleeves onto PET bottles, glass bottles, and various container shapes. Featuring a double head ...
10877. Precision Temperature and Humidity Oven for Semiconductor Production [Mar 02, 2026]
[Mar 02, 2026] Product Description High temperature vacuum oven Large vacuum drying oven designed for various purposes of vacuum drying. Leave space for installing the vacuum pump. It adopts quick connection flange piping method and ...
10878. Premium Silicone Sealant: Quick Drying and Fireproof Solution [Feb 12, 2026]
[Feb 12, 2026] RUNTAI FIREPROOF WEATHERPROOF SILICONE SEALANT Overview RT-119 is a high-performance, single-component, neutral-cure fireproof silicone sealant designed for industrial and glazing applications. It forms a ...
10879. High-Performance Fireproof Silicone Sealant for Windows & Doors [Feb 12, 2026]
[Feb 12, 2026] RUNTAI FIREPROOF WEATHERPROOF SILICONE SEALANT Overview RT-119 is a high-performance, single-component, neutral-cure fireproof silicone sealant designed for industrial and glazing applications. It forms a ...
10880. China Factory Supply Glass Polishing Material High Purity 30% Cerium Oxide Polishing Liquid ... [Feb 12, 2026]
[Feb 12, 2026] Product Description 1.Polishing material 2.Uv resistant application of textiles, ceramics, silica gel, coatings and other materials [Product Features] 1.Good fluidity, not easy to precipitate, can be diluted with ...
10881. Nano Cerium Oxide Dispersion Liquid Cerium Oxide Dispersion Dispersion CEO2 Dispersion 30% Cerium ... [Feb 12, 2026]
[Feb 12, 2026] Product Description 1.Polishing material 2.Uv resistant application of textiles, ceramics, silica gel, coatings and other materials [Product Features] 1.Good fluidity, not easy to precipitate, can be diluted with ...
10882. Nano Cerium Oxide Dispersion Liquid Dispersion CEO2 Dispersion 30% Cerium Oxide Nanoparticlesno ... [Feb 12, 2026]
[Feb 12, 2026] Product Description 1.Polishing material 2.Uv resistant application of textiles, ceramics, silica gel, coatings and other materials [Product Features] 1.Good fluidity, not easy to precipitate, can be diluted with ...
10883. China Raw Material Glass Polishing Material High Purity 30% Cerium Oxide Polishing Liquid ... [Feb 12, 2026]
[Feb 12, 2026] Product Description 1.Polishing material 2.Uv resistant application of textiles, ceramics, silica gel, coatings and other materials [Product Features] 1.Good fluidity, not easy to precipitate, can be diluted with ...
10884. Double Layer Quartz Vacuum Reactor with Flange Clear Quartz Glass Reaction Tube for Solar Cell [Feb 27, 2026]
[Feb 27, 2026] High Temperature Resistant Clear Quartz Glass Reaction Tube With Double Layer Quartz Reactor with Flange Product Description Product Name Double Layer Quartz Reactor with Flange Clear Quartz Glass Reaction Tube ...
10885. 60g/H 220V CE RoHS Certificate Air Cooling Quartz Tube Cell Kit Part Module Ozone Generator [Feb 27, 2026]
[Feb 27, 2026] Air cooling ozone generator spare parts with module power supply suitable for household water purification equipment, air purification machine, disinfection cabinet, medical ozone equipment oxygen bar, refrigerators, ...
10886. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
10887. Advanced Fully Automatic Die Bonding Machine for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
10888. Advanced Automated Back Grinding Machine for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
10889. Advanced High Efficiency Hmds Pretreatment System for Adhesives [Feb 28, 2026]
[Feb 28, 2026] Product Description Advantages of HMDS pretreatment system: 1. The pretreatment performance is better. Since the HMDS treatment is carried out after several nitrogen replacements, there will be no interference ...
10890. Advanced Smart Laser Debonding System with Real-Time Monitoring [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
