Jiangsu Profile
Product List
10891. 60g/H 220V CE RoHS Certificate Air Cooling Quartz Tube Cell Kit Part Module Ozone Generator 
[Feb 27, 2026]
[Feb 27, 2026] Air cooling ozone generator spare parts with module power supply suitable for household water purification equipment, air purification machine, disinfection cabinet, medical ozone equipment oxygen bar, refrigerators, ...
10892. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
10893. Advanced Fully Automatic Die Bonding Machine for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
10894. Advanced Automated Back Grinding Machine for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
10895. Advanced High Efficiency Hmds Pretreatment System for Adhesives [Feb 28, 2026]
[Feb 28, 2026] Product Description Advantages of HMDS pretreatment system: 1. The pretreatment performance is better. Since the HMDS treatment is carried out after several nitrogen replacements, there will be no interference ...
10896. Advanced Smart Laser Debonding System with Real-Time Monitoring [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
10897. Advanced Fully Automatic Semiconductor Molding System with Quick Mold Change [Feb 28, 2026]
[Feb 28, 2026] Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 inch touch screen+touch ...
10898. Advanced High Precision Die Bonder for Semiconductor Packaging [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
10899. Advanced Automated Wafer Film Application and Cleaning Solution for Precision Manufacturing [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
10900. Advanced Precision Wafer Die Bonder with Smart Control Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
10901. Advanced Precision Eutectic Die Bonding Equipment for High-Quality Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for different kinds ...
10902. High-Temperature 600 °C Hot Air Circulation Furnace for Ceramics [Feb 28, 2026]
[Feb 28, 2026] Product Description Hot air circulation rubber discharge furnace (degreasing furnace) The hot air circulation dispensing furnace is specifically designed for the dispensing process of ceramics using various molding ...
10903. Advanced Integrated Furnace for High-Quality Aluminum Nitride Substrates [Feb 28, 2026]
[Feb 28, 2026] Product Description Mainly used for precision dispensing of aluminum nitride ceramic substrates, silicon nitride ceramic substrates, dielectric ceramics, SOFC solid fuel cell cells, nitrogen oxygen sensors, and other ...
10904. Advanced Automatic High Precision Die Bonder for Qfp/Lqfp/Qfn [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
10905. Ultra High Grade High Purity Elite Fused Silica Sand for High-End Kiln Lining Solutions with Patent ... [Feb 06, 2026]
[Feb 06, 2026] Product Description Through the refined processes of specialized mechanical processing, precision screening and deep iron removal, this material can be fabricated into finished products in block, granular and powder ...
