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60g/H 220V CE RoHS Certificate Air Cooling Quartz Tube Cell Kit Part Module Ozone Generator
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10891.

60g/H 220V CE RoHS Certificate Air Cooling Quartz Tube Cell Kit Part Module Ozone Generator Open Details in New Window [Feb 27, 2026]

Air cooling ozone generator spare parts with module power supply suitable for household water purification equipment, air purification machine, disinfection cabinet, medical ozone equipment oxygen bar, refrigerators, ...

Company: LIANYUNGANG BAIBO NEW MATERIAL CO., LTD.

China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
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10892.

China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine Open Details in New Window [Feb 28, 2026]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Fully Automatic Die Bonding Machine for Semiconductor Production
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10893.

Advanced Fully Automatic Die Bonding Machine for Semiconductor Production Open Details in New Window [Feb 28, 2026]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Automated Back Grinding Machine for Semiconductor Wafers
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10894.

Advanced Automated Back Grinding Machine for Semiconductor Wafers Open Details in New Window [Feb 28, 2026]

High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High Efficiency Hmds Pretreatment System for Adhesives
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10895.

Advanced High Efficiency Hmds Pretreatment System for Adhesives Open Details in New Window [Feb 28, 2026]

Product Description Advantages of HMDS pretreatment system: 1. The pretreatment performance is better. Since the HMDS treatment is carried out after several nitrogen replacements, there will be no interference ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Smart Laser Debonding System with Real-Time Monitoring
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10896.

Advanced Smart Laser Debonding System with Real-Time Monitoring Open Details in New Window [Feb 28, 2026]

Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Fully Automatic Semiconductor Molding System with Quick Mold Change
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10897.

Advanced Fully Automatic Semiconductor Molding System with Quick Mold Change Open Details in New Window [Feb 28, 2026]

Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 inch touch screen+touch ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High Precision Die Bonder for Semiconductor Packaging
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10898.

Advanced High Precision Die Bonder for Semiconductor Packaging Open Details in New Window [Feb 28, 2026]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Automated Wafer Film Application and Cleaning Solution for Precision Manufacturing
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10899.

Advanced Automated Wafer Film Application and Cleaning Solution for Precision Manufacturing Open Details in New Window [Feb 28, 2026]

Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Precision Wafer Die Bonder with Smart Control Technology
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10900.

Advanced Precision Wafer Die Bonder with Smart Control Technology Open Details in New Window [Feb 28, 2026]

Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Precision Eutectic Die Bonding Equipment for High-Quality Applications
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10901.

Advanced Precision Eutectic Die Bonding Equipment for High-Quality Applications Open Details in New Window [Feb 28, 2026]

Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for different kinds ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Temperature 600 °C Hot Air Circulation Furnace for Ceramics
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10902.

High-Temperature 600 °C Hot Air Circulation Furnace for Ceramics Open Details in New Window [Feb 28, 2026]

Product Description Hot air circulation rubber discharge furnace (degreasing furnace) The hot air circulation dispensing furnace is specifically designed for the dispensing process of ceramics using various molding ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Integrated Furnace for High-Quality Aluminum Nitride Substrates
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10903.

Advanced Integrated Furnace for High-Quality Aluminum Nitride Substrates Open Details in New Window [Feb 28, 2026]

Product Description Mainly used for precision dispensing of aluminum nitride ceramic substrates, silicon nitride ceramic substrates, dielectric ceramics, SOFC solid fuel cell cells, nitrogen oxygen sensors, and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Automatic High Precision Die Bonder for Qfp/Lqfp/Qfn
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10904.

Advanced Automatic High Precision Die Bonder for Qfp/Lqfp/Qfn Open Details in New Window [Feb 28, 2026]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Ultra High Grade High Purity Elite Fused Silica Sand for High-End Kiln Lining Solutions with Patent ...
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10905.

Ultra High Grade High Purity Elite Fused Silica Sand for High-End Kiln Lining Solutions with Patent ... Open Details in New Window [Feb 06, 2026]

Product Description Through the refined processes of specialized mechanical processing, precision screening and deep iron removal, this material can be fabricated into finished products in block, granular and powder ...

Company: Lianyungang Runlai Quartz Technology Co., Ltd.