Jiangsu Profile
Product List
10351. Premium Neutral Silicone Sealant - Fast-Drying Adhesive Glue 
[Dec 13, 2025]
[Dec 13, 2025] RUNTAI NEUTRAL SILICONE SEALANT Overview RT-193 is a ready to use, one component, neutral silicone sealant for industrial and glazing applications. It cures at room temperature by the action with atmosphere moisture to ...
10352. Versatile One Component Adhesive for Aluminum and Glass Projects [Dec 13, 2025]
[Dec 13, 2025] RUNTAI NEUTRAL SILICONE SEALANT Overview RT-193 is a ready to use, one component, neutral silicone sealant for industrial and glazing applications. It cures at room temperature by the action with atmosphere moisture to ...
10353. Automatic High Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn [Dec 13, 2025]
[Dec 13, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
10354. Advanced Semiconductor Oven with Precision Temp and Humidity Control [Dec 13, 2025]
[Dec 13, 2025] Product Description High temperature vacuum oven Large vacuum drying oven designed for various purposes of vacuum drying. Leave space for installing the vacuum pump. It adopts quick connection flange piping method and ...
10355. Advanced Laser Debonding Machine with Live Monitoring System [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
10356. Advanced Automated Back Grinding Machine for Semiconductor Wafers [Dec 13, 2025]
[Dec 13, 2025] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
10357. High Efficiency Hmds Pretreatment System/Hmds Glue Applicator [Dec 13, 2025]
[Dec 13, 2025] Product Description Advantages of HMDS pretreatment system: 1. The pretreatment performance is better. Since the HMDS treatment is carried out after several nitrogen replacements, there will be no interference ...
10358. Advanced High Precision Die Bonder for Semiconductor Packaging [Dec 13, 2025]
[Dec 13, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
10359. Fully Automatic Semiconductor Molding System with Easy Mold Swapping [Dec 13, 2025]
[Dec 13, 2025] Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 inch touch screen+touch ...
10360. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
10361. Advanced Automatic Wafer Film Application and Cleaning Equipment [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
10362. Advanced Dual Dispensing Eutectic Die Bonding Machine for Precision [Dec 13, 2025]
[Dec 13, 2025] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
10363. Advanced Pre-Firing Integrated Furnace for Aluminum Nitride Substrates [Dec 13, 2025]
[Dec 13, 2025] Product Description Mainly used for precision dispensing of aluminum nitride ceramic substrates, silicon nitride ceramic substrates, dielectric ceramics, SOFC solid fuel cell cells, nitrogen oxygen sensors, and other ...
10364. Fully Automatic Die Bonding Machine for Advanced Semiconductor Assembly [Dec 13, 2025]
[Dec 13, 2025] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
10365. Custom Candle Jar Glass Candle Container with Lid [Dec 12, 2025]
[Dec 12, 2025] Product size: 70*65*85mm Capacity: 200ml Packing quantity: 90pcs Weight: 17kgs Box size: 42 * 35.5 * 26.5 cm Product size: 80*75*90mm Capacity: 315ml Packing quantity: 72pcs Weight: 19kgs Box size: 48.5 * 32.5 * 28.5 cm ...
Company: Jiangsu Smile Tools Co., Ltd.
