Jiangsu Profile
Product List
9166. Versatile Carbon Dioxide Laser Marking Tool for Artisans 
[Feb 28, 2026]
[Feb 28, 2026] Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...
9167. High-Precision Tgv Laser Drilling System for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] Tgv High-End Precision Laser Drilling Machine Tgv industrial equipment factory supplier Product Description New Fully Automated Dual-Station Laser Cutter Sets Benchmark for Brittle Material Processing We are ...
9168. Advanced Fully Automatic Desktop Dispensing Machine for Precision Production [Feb 28, 2026]
[Feb 28, 2026] High-Precision Desktop Dispensing Machine Fully Automatic Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD grounding ...
9169. Automatic CCD Visual Glue Dispenser Machine Semiautomatic Three-Axis Desktop Dispensing Equipment ... [Feb 28, 2026]
[Feb 28, 2026] Industrial Dispensing machine Desktop Robot Glue coating Dispenser device producer Product Description Product Parameters Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
9170. Advanced UV Laser Annealing Equipment for Bsi CCD Fabrication [Feb 28, 2026]
[Feb 28, 2026] Sic UV Laser Annealing Machine for Bsi-CCD Wafer Precise Energy Density Control Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly ...
9171. Versatile Laser Engraving Equipment for PCB Fabrication Needs [Feb 28, 2026]
[Feb 28, 2026] High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA ...
9172. High-Speed Automatic Die Attach Equipment for Precision Bonding [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
9173. Innovative Loading and Unloading System for Efficient Logistics [Feb 28, 2026]
[Feb 28, 2026] Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...
9174. Precision Silicone Adhesive Dispenser for Efficient Production Lines [Feb 28, 2026]
[Feb 28, 2026] Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control Industrial personal computer + motion ...
9175. Advanced Semiconductor Bonding Solutions for 6 to 10 Inch Devices [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Introduction: The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving ...
9176. Precision Stainless Steel Laser Marking Machine with Mopa Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya Femtosecond Laser Marking Machine - The Pinnacle of Cold-Ablation Precision Transcend the Limits of Traditional Laser Marking Introducing the Himalaya Femtosecond Laser Marking ...
9177. Advanced Vocs Catalytic Combustion System for Spray Painting Efficiency [Feb 28, 2026]
[Feb 28, 2026] Vocs Catalytic Combustion for Spray Painting machine glue Coating Rotary Printing Chemical Production industrial equipment Product Description 1,Scope of application The organic waste gas flow rate is 1000 ~100000 ...
9178. PCB Laser Marking Systems for Electronics Manufacturing [Feb 28, 2026]
[Feb 28, 2026] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Automated PCB Laser Marking System Precision Marking for Electronics Manufacturing Our PCB Laser Marking Systems provide ...
9179. Automatic LED/IC Flip Chip Die Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
9180. Advanced IC Wafer Alignment Tools for Precision Engineering [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
