Jiangsu Profile
Product List
9166. High Precision Die Bonding Machine for PCB and IC Assembly 
[Feb 28, 2026]
[Feb 28, 2026] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
9167. High-Precision Automatic Die Bonding Equipment for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
9168. Advanced Laser Marking System for Precision Wafer Solutions [Feb 28, 2026]
[Feb 28, 2026] High Standard UV Laser Marking Machine for Food, PVC Pipe, Medicine Packaging Material Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, ...
9169. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
9170. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
9171. High-Precision Laser Marking Machine for Mobile Device Pcbs [Feb 28, 2026]
[Feb 28, 2026] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer ...
9172. Advanced Precision Laser Cutting Machine with Real-Time Feedback [Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive fiber laser cutting equipment. It has the advantages of stable performance, high ...
9173. Precision Laser Trimming Equipment for Superior LED Displays [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
9174. High-Power 200W CO2 Laser Engraver for Wood, Acrylic, and More [Feb 28, 2026]
[Feb 28, 2026] Product Description It can be widely used in graphic marks on craft gifts, clothing leather, wood paper, food packaging, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and other ...
9175. Advanced CCD Glue Dispensing Robot for Industrial Applications [Feb 28, 2026]
[Feb 28, 2026] Automatic Desktop Dispensing Robot Vision Glue Dispensing Machine CCD Visual Positioning equipment Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
9176. Precision Desktop Liquid Gluing Dispensing System Potting Machine for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] Industrial Dispensing machine Desktop Robot Glue coating Dispenser device producer Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
9177. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Feb 28, 2026]
[Feb 28, 2026] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
9178. Custom Laminator System Optimized for Semiconductor Production Needs [Feb 28, 2026]
[Feb 28, 2026] Product Description Manual Film Laminator Series Product Description Product Overview This manual film laminator series is engineered for fast and efficient application of protective film onto wafers, glass, ...
9179. Advanced Sic Laser Annealing Equipment for Industrial Solutions [Feb 28, 2026]
[Feb 28, 2026] 6 Inch 8 Inch Sic Laser Annealing Machine Sic Laser Annealing Equipment with Fully Autonomous Optical System Product Description Product Features First domestic green laser machine for mass pruduction High ...
9180. Advanced Picosecond Laser Glass Cutter for Precision Efficiency [Feb 28, 2026]
[Feb 28, 2026] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
