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Factory Price PCBA IC Wafer Automatic Positioning and Marking Equipment
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8701.

Factory Price PCBA IC Wafer Automatic Positioning and Marking Equipment Open Details in New Window [Sep 18, 2025]

Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

355nm UV Laser Depaneling Machine: 20μM Precision Cutting for PCB
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8702.

355nm UV Laser Depaneling Machine: 20μM Precision Cutting for PCB Open Details in New Window [Sep 18, 2025]

Product Description 355nm UV Laser Cutting Machine Laser depaneling machine for PCB and related industry. Utilizing a high-performance UV laser, it minimizes the heat-affected zone for high-density PCBA products. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry
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8703.

PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry Open Details in New Window [Sep 18, 2025]

PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Loading and Unloading UV Laser 15W Wafer Cutting Machine
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8704.

Automatic Loading and Unloading UV Laser 15W Wafer Cutting Machine Open Details in New Window [Sep 18, 2025]

Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing Features: 1. With 355nm UV laser, the cutting machine has stable performance, good light spot, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Wafer Die Bonder Dispensing Equipment
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8705.

High Precision Wafer Die Bonder Dispensing Equipment Open Details in New Window [Sep 18, 2025]

High Precision Wafer Die Bonder Dispensing Equipment Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Hot Sell 355nm UV Laser Marking Machine for Code Engraving and Printing
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8706.

Hot Sell 355nm UV Laser Marking Machine for Code Engraving and Printing Open Details in New Window [Sep 18, 2025]

UV laser marking system The UV laser marking system is characterized by its small size, low power consumption, long lifespan, high efficiency, and maintenance - free operation. It is convenient to install and carry. The ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precison Marking Automatic CCD UV Laser Marking Machine for IC/PCB
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8707.

Precison Marking Automatic CCD UV Laser Marking Machine for IC/PCB Open Details in New Window [Sep 18, 2025]

Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System Product Description Wafer Marking 1. Product compatible size: 8-12 inch ring crystal cage; 2. Equipped with a crystal loading system that ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

10W/ 25W 355nm UV Laser Engraving Machine for Semiconductor Production
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8708.

10W/ 25W 355nm UV Laser Engraving Machine for Semiconductor Production Open Details in New Window [Sep 18, 2025]

4W / 7W / 10W /15W / 25W 355nm UV Laser Engraving Machine Wood and Metal Laser Engraver Machine Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Mps-0606lm Precision Laser Cutting Machine for Precision Machining of Thin Metal
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8709.

Mps-0606lm Precision Laser Cutting Machine for Precision Machining of Thin Metal Open Details in New Window [Sep 18, 2025]

Mps-0606lm Precision Laser Cutting Machine for Precision Machining of Thin Metal Product Description Product overview: MPS-0606LM is a product specially for the small format precision laser cutting market. It is ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Dicing Saw for Semiconductor Industry High Precision Dicing Machine
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8710.

Wafer Dicing Saw for Semiconductor Industry High Precision Dicing Machine Open Details in New Window [Sep 18, 2025]

Product Description It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of feed ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Temperature Resistant White Bellows Straight Section PTFE Polytetrafluoroethylene Corrugated ...
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8711.

High Temperature Resistant White Bellows Straight Section PTFE Polytetrafluoroethylene Corrugated ... Open Details in New Window [Sep 17, 2025]

High Performance Anti-Corrosive PTFE Hose The pipe has changed the characteristics that the pipe can not be bent by special processing methods. It can be used to connect the lower graphite and ceramic glass pipes and ...

Company: Comflex Industrial Co., Ltd.

Saige Premium Carbon Steel Balls for Drawer Slider Applications
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8712.

Saige Premium Carbon Steel Balls for Drawer Slider Applications Open Details in New Window [Sep 17, 2025]

Core specifications and production capacity of steel balls Popular specifications: 0.5mm, 1mm, 1.5mm, 2.381mm, 1/4 ", 5/16", 3/8 ", 1/2", 5/8 ", 7/8", 1" Full range customization: can produce steel balls with different ...

Company: Changzhou Feige Steel Ball Co., Ltd.

Three-Layer Anticorrosion Inner Coating for New and Existing Pipeline Protection
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8713.

Three-Layer Anticorrosion Inner Coating for New and Existing Pipeline Protection Open Details in New Window [Sep 17, 2025]

System Overview The double-sided butyl rubber adhesive tape is a cold-applied material designed as the inner layer of a multi-ply pipeline coating system. It is primarily used for the corrosion protection of oil, gas, ...

Company: Huaian Construction New Material CO., LTD.

High-Efficiency 500W Pulse Laser Cleaning Machine for Industrial Use
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8714.

High-Efficiency 500W Pulse Laser Cleaning Machine for Industrial Use Open Details in New Window [Sep 15, 2025]

Product Description 500W Pulse laser cleaning machine Laser cleaning is an emerging cleaning method in industrial cleaning. Our company's LCP-500 (standard product) laser cleaning equipment adopts high peak power ...

Company: SUZHOU CHIRUI ELECTROMECHANICAL TECHNOLOGY CO., LTD.

High-Power 200W Laser Cleaning System for Rust and Paint
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8715.

High-Power 200W Laser Cleaning System for Rust and Paint Open Details in New Window [Sep 15, 2025]

Product Description Laser cleaning is an emerging cleaning method in industrial cleaning. Our company's LCP-200 (standard product) laser cleaning equipment adopts high peak power pulse lasers, imported high-speed ...

Company: SUZHOU CHIRUI ELECTROMECHANICAL TECHNOLOGY CO., LTD.