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Innovative Integrated Machine for Efficient Lamination and Encapsulation
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8401.

Innovative Integrated Machine for Efficient Lamination and Encapsulation Open Details in New Window [Dec 13, 2025]

Features •Complete the processes of short-side butyl adhesive, short side insulating adhesive, short-side busbar tape, long-side conductive adhesive tape, four-side butyl adhesive tape film covering, and laminating ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Fully Automatic Laser Marking Machine for Wafer ID
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8402.

Advanced Fully Automatic Laser Marking Machine for Wafer ID Open Details in New Window [Dec 13, 2025]

Fully Automatic Wafer ID Laser Marking Machine Product Description 1. Applied to semiconductor wafer ID marking, compatible with products under 12 inches; 2. Fully automatic operation, equipped with FFU ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
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8403.

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms Open Details in New Window [Dec 13, 2025]

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed Fiber Laser Marking Machine for Versatile Applications
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8404.

High-Speed Fiber Laser Marking Machine for Versatile Applications Open Details in New Window [Dec 13, 2025]

Product Description Product Features Structure: One-piece, split, vertical, horizontal, etc., for all testers High Reliability, long life fiber laser Max. UPH up to 60K Offline control mode,good ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment
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8405.

High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment Open Details in New Window [Dec 13, 2025]

Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic CCD Visual Glue Dispenser Machine
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8406.

Automatic CCD Visual Glue Dispenser Machine Open Details in New Window [Dec 13, 2025]

Automatic CCD Visual Glue Dispenser Machine semiautomatic Three-Axis Desktop Dispensing Robot equipment factory Product Description Standard Features Computer Control, Windows OS CCD visual positioning ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Fiber Laser Marking Machine for Plastic Card Engraving
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8407.

Advanced Fiber Laser Marking Machine for Plastic Card Engraving Open Details in New Window [Dec 13, 2025]

Product Description Brief Description Fiber Laser mainly applicable to metal materials, partial plastic materials and coated non-metal materials by high-speed flight marking. Such as aluminum,stainless steel,copper ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision 355nm UV Laser Engraver for Metal and Plastic
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8408.

High-Precision 355nm UV Laser Engraver for Metal and Plastic Open Details in New Window [Dec 13, 2025]

Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced UV Laser Marking Machine for High-Performance Glass Silica Gel
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8409.

Advanced UV Laser Marking Machine for High-Performance Glass Silica Gel Open Details in New Window [Dec 13, 2025]

Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Automatic CCD UV Laser Marking Machine for Ics and Pcbs
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8410.

High-Precision Automatic CCD UV Laser Marking Machine for Ics and Pcbs Open Details in New Window [Dec 13, 2025]

Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System Product Description Wafer Marking 1. Product compatible size: 8-12 inch ring crystal cage; 2. Equipped with a crystal loading system that ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Seam Welding Machine for Metal and Ceramic Applications
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8411.

Precision Seam Welding Machine for Metal and Ceramic Applications Open Details in New Window [Dec 13, 2025]

Product Description The ZFH-25 automatic parallel seam welding machine is an automated equipment mainly composed of an automatic feeding mechanism, pre welding system, Y-direction seam welding head, Y-direction seam ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Electroplating Cleaning Machine for Precision Metal Finishing
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8412.

Advanced Electroplating Cleaning Machine for Precision Metal Finishing Open Details in New Window [Dec 13, 2025]

High-Quality Electroplating Cleaning Machine for Electroplating, Plating, Oxidation, Etching and Cleaning Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Anti-Counterfeiting Marking for Tobacco Food Logo Flying Marking Machine
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8413.

Laser Anti-Counterfeiting Marking for Tobacco Food Logo Flying Marking Machine Open Details in New Window [Dec 13, 2025]

Product Description Brief Description The laser marking machine can code cigarettes, package cigarettes, strip cigarettes, and cigars, which can play the role of anti-counterfeiting, traceability management and so ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Laser Grooving Cutting Equipment with Special Customized Laser Head
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8414.

High Precision Laser Grooving Cutting Equipment with Special Customized Laser Head Open Details in New Window [Dec 13, 2025]

High Precision Laser Grooving Cutting Equipment with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Ultra-Shallow UV Dopant Laser Annealing Equipment for Bsi-CCD & Sic Wafers
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8415.

Advanced Ultra-Shallow UV Dopant Laser Annealing Equipment for Bsi-CCD & Sic Wafers Open Details in New Window [Dec 13, 2025]

Premium-Grade Sic UV Laser Annealing Machine for BSI-CCD Wafers Product Description Shallow Dopant Laser Annealing for BSI-CCD and Advanced Semiconductors In the relentless pursuit of smaller, faster, and more ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.