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Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, PCB Board
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7801.

Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, PCB Board Open Details in New Window [Oct 22, 2025]

Product Description Our Automatic Dicing Saw Machine can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of feed ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine
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7802.

High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Open Details in New Window [Oct 22, 2025]

High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Price Fiber Laser Marking/Engraving Machine for PVC Steel Aluminum Brass Plastic
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7803.

Factory Price Fiber Laser Marking/Engraving Machine for PVC Steel Aluminum Brass Plastic Open Details in New Window [Oct 22, 2025]

Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable marking on a ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing
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7804.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing Open Details in New Window [Oct 22, 2025]

Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly
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7805.

12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly Open Details in New Window [Oct 22, 2025]

12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Refractory Fire Resistance Bio-Soluble Needle Fiber Blanket for Kiln Furnace
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7806.

Refractory Fire Resistance Bio-Soluble Needle Fiber Blanket for Kiln Furnace Open Details in New Window [Sep 26, 2025]

Refractory fire resistance bio-soluble needle fiber blanket for kiln furnace Product Description Soluble ceramic fibre needle-punched blankets represent an alkaline earth silicate fibre developed and introduced in ...

Company: Kaowoo Thermal Insulation Co., Ltd

Fully Automatic Laser Engraving Machine for Laser Labeling in The Automotive Industry
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7807.

Fully Automatic Laser Engraving Machine for Laser Labeling in The Automotive Industry Open Details in New Window [Oct 21, 2025]

Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer application scenarios Provide cost-effective equipment ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Free Brazing of High-Power Chips and Substrate Vacuum Eutectic Welding Furnace
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7808.

Free Brazing of High-Power Chips and Substrate Vacuum Eutectic Welding Furnace Open Details in New Window [Oct 21, 2025]

High Reliability Cavity Free Brazing of High-Power Chips and Substrate Vacuum Eutectic Welding Furnace Product Description Vacuum eutectic welding furnace VSR-20MPA The advanced process system assisted by microwave ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience
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7809.

Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience Open Details in New Window [Oct 20, 2025]

Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing
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7810.

Carbon Dioxide Laser Marking Machine for Craft Gifts, Fixtures, Leather Clothing Open Details in New Window [Oct 20, 2025]

Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot
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7811.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Open Details in New Window [Oct 20, 2025]

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head
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7812.

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Open Details in New Window [Oct 20, 2025]

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-End Lab Furniture Laboratory Table Laboratory Bench with Stain-Resistance Jh-SL163
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7813.

High-End Lab Furniture Laboratory Table Laboratory Bench with Stain-Resistance Jh-SL163 Open Details in New Window [Sep 25, 2025]

Model:JH-SL163 1. Certification: Authorized SGS certification showing the conformity of US standard SEFA-8M, which test many items including weight capacity of steel cabinet etc. This certification shows the ...

Company: JIANGSU JIAHONG LABORATORY EQUIPMENT CO.,LTD.

Wholesale Stainless Steel Pepper Mill Shaker and Salt Grinders Mills
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7814.

Wholesale Stainless Steel Pepper Mill Shaker and Salt Grinders Mills Open Details in New Window [Sep 24, 2025]

Product Description Stainless Steel Pepper Mill Shaker and Salt Grinders Mills Item spice bottle, spice grinder, salt & pepper grinder, spice mill, salt grinder, pepper mill Material Soda-Lime Glass + ceramic ...

Company: Xuzhou Selead Packaging Material Co., Ltd.

Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control
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7815.

Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Open Details in New Window [Oct 16, 2025]

Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.