Jiangsu Profile
Product List
9136. Advanced Precision Laser Cutting Machine with Real-Time Feedback 
[Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive fiber laser cutting equipment. It has the advantages of stable performance, high ...
9137. Precision Laser Trimming Equipment for Superior LED Displays [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
9138. High-Power 200W CO2 Laser Engraver for Wood, Acrylic, and More [Feb 28, 2026]
[Feb 28, 2026] Product Description It can be widely used in graphic marks on craft gifts, clothing leather, wood paper, food packaging, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and other ...
9139. Advanced CCD Glue Dispensing Robot for Industrial Applications [Feb 28, 2026]
[Feb 28, 2026] Automatic Desktop Dispensing Robot Vision Glue Dispensing Machine CCD Visual Positioning equipment Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
9140. Precision Desktop Liquid Gluing Dispensing System Potting Machine for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] Industrial Dispensing machine Desktop Robot Glue coating Dispenser device producer Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
9141. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Feb 28, 2026]
[Feb 28, 2026] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
9142. Custom Laminator System Optimized for Semiconductor Production Needs [Feb 28, 2026]
[Feb 28, 2026] Product Description Manual Film Laminator Series Product Description Product Overview This manual film laminator series is engineered for fast and efficient application of protective film onto wafers, glass, ...
9143. Advanced Sic Laser Annealing Equipment for Industrial Solutions [Feb 28, 2026]
[Feb 28, 2026] 6 Inch 8 Inch Sic Laser Annealing Machine Sic Laser Annealing Equipment with Fully Autonomous Optical System Product Description Product Features First domestic green laser machine for mass pruduction High ...
9144. Advanced Picosecond Laser Glass Cutter for Precision Efficiency [Feb 28, 2026]
[Feb 28, 2026] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
9145. Versatile Laser Engraver and Cutter for Windows Users [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm (Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ±0.02mm Electric Power ...
9146. Automatic High Speed Epoxy Die Bonder Machine Manufacturer [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Ultra High-Speed Silver Paste Die Bonder Unmatched Speed and Precision for Modern Semiconductor Assembly Introducing our fully automatic ...
9147. 5W/10W/15W/30W/40W/60W/90W Gxp Series Green UV Picosecond Laser [Feb 28, 2026]
[Feb 28, 2026] Product Description 5W/10W/15W UV Picosecond Laser - High-Precision Solution for Micromachining and Industrial Applications The GXP Series UV Picosecond Laser is a next-generation picosecond laser for ...
9148. Efficient High-Speed Die Bonder for Semiconductor Assembly Lines [Feb 28, 2026]
[Feb 28, 2026] High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding ...
9149. High-Precision FPCB Laser Cutting and Placement System for Production [Feb 28, 2026]
[Feb 28, 2026] High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, circuit board ...
9150. Advanced Laser Wafer Marking System for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch ...
