Jiangsu Profile
Product List
8026. Automatic High Speed Epoxy Die Bonder Machine Manufacturer 
[Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Die Bonding Machine System manufacturer Product Description Ultra High-Speed Silver Paste Die Bonder Unmatched Speed and Precision for Modern Semiconductor Assembly Introducing our fully automatic ...
8027. Advanced Laser Marking System for Precision Wafer Solutions [Dec 13, 2025]
[Dec 13, 2025] High Standard UV Laser Marking Machine for Food, PVC Pipe, Medicine Packaging Material Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, ...
8028. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Dec 13, 2025]
[Dec 13, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
8029. Professional Silicone Glue Dispenser for Streamlined Assembly Lines [Dec 13, 2025]
[Dec 13, 2025] Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control Industrial personal computer + motion ...
8030. 12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly [Dec 13, 2025]
[Dec 13, 2025] 12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
8031. Advanced Bsi-CCD Wafer Laser Annealing Equipment for Precision Energy Control [Dec 13, 2025]
[Dec 13, 2025] Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with ...
8032. Premium Fmj Series High-Temperature Furnace for Industrial Applications [Dec 13, 2025]
[Dec 13, 2025] High Quality Fmj Series High-Temperature Box Sintering Furnace Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation ...
8033. Advanced High-Precision Laser Marking System for PCB Manufacturing [Dec 13, 2025]
[Dec 13, 2025] High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA standard ...
8034. High Precision Die Bonding Machine for PCB and IC Assembly [Dec 13, 2025]
[Dec 13, 2025] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
8035. High-Precision CCD Wafer Splitting Machine for Sic Semiconductor Chips [Dec 13, 2025]
[Dec 13, 2025] Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...
8036. Automatic LED/IC Flip Chip Die Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV ...
8037. Dry-in/Dry-out (DIDO) Process Chemical Mechanical Polishing Machine System for Wafer Polishing [Dec 13, 2025]
[Dec 13, 2025] Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
8038. Automatic Wafer Dicing Machine for Silicon Wafers, GaAs, GaN, PCB Board [Dec 13, 2025]
[Dec 13, 2025] Product Description Our Automatic Wafer Dicing Machine can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of feed ...
8039. PCB Laser Marking Systems for Electronics Manufacturing [Dec 13, 2025]
[Dec 13, 2025] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Automated PCB Laser Marking System Precision Marking for Electronics Manufacturing Our PCB Laser Marking Systems provide ...
8040. High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device [Dec 13, 2025]
[Dec 13, 2025] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
