Jiangsu Profile
Product List
7996. Stainless Steel Pepper Grinder, Seasoning Bottle, Glass Seasoning Bottle, Grinder, Crusher 
[Nov 26, 2025]
[Nov 26, 2025] Product Description Durable Construction: Fashioned from robust stainless steel, this salt pepper shaker set boasts longevity and durability, solidifying their status as dependable kitchen accessories. Easy Refilling: ...
7997. Transformation Art Coffee Dripper Filter Porcelain Portable Pour Over Coffee Maker Set [Dec 16, 2025]
[Dec 16, 2025] Product name Kiln Transformation Art Coffee Dripper Filter Size two size is optional 9*12cm/7.5*9.5cm Usage Making coffee/Home/Office/Bar/Cafe/ Function filter,dripper Packing Color ...
Company: LIANYUNGANG KAESHING INTERNATIONAL TRADING CO., LTD.
7998. High-Performance Silicone Adhesive for Marble and Stone Bonding [Nov 22, 2025]
[Nov 22, 2025] RT-5200 Stone Marble Silicone Sealant - Weatherproof Adhesive STONE SILICONE SEALANT RT-5200 is an exceptionally advanced, ready-to-use, single-component neutral silicone sealant, expertly designed for industrial and ...
7999. Versatile Silicone Adhesive for Ceramic and Industrial Use [Nov 22, 2025]
[Nov 22, 2025] RT-5200 Stone Marble Silicone Sealant - Weatherproof Adhesive STONE SILICONE SEALANT RT-5200 stands as a pinnacle in sealing technology, a superbly engineered, ready-to-use, single-component neutral silicone sealant. It ...
8000. Premium 590ml Neutral Rubber Silicone Sealant for Construction Projects [Dec 13, 2025]
[Dec 13, 2025] RT-193 Silicone Sealant: Premium Performance for Demanding Applications RT-193 represents a superior, high-grade silicone sealant specifically formulated for industrial and glazing uses. This advanced one-part, ...
8001. Durable P0 Kovar Wire by Dilver for Precision Aging Needs [Dec 15, 2025]
[Dec 15, 2025] Product Description Kovar (Alloy K) is a nickel-iron-cobalt controlled-expansion alloy containing 29% nickel. Its coefficient of expansion, which decreases with rising temperature to the inflection point, matches ...
8002. High-Precision FPCB Laser Cutting and Placement System for Production [Dec 13, 2025]
[Dec 13, 2025] High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, circuit board ...
8003. Advanced Automatic Lead Wire Bonding Machine for Precision Tasks [Dec 13, 2025]
[Dec 13, 2025] High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...
8004. Efficient High-Speed Die Bonder for Semiconductor Assembly Lines [Dec 13, 2025]
[Dec 13, 2025] High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding ...
8005. Advanced Double-Tube Vertical Furnace for Pi Cuer Annealing Process [Dec 13, 2025]
[Dec 13, 2025] Double-Tube Fully Automatic Vertical Furnace for PI Cuer, annealing, alloy Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, ...
8006. High-Precision Automatic Die Bonding Machine for Semiconductor Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
8007. Advanced Laser Wafer Marking Machine for Semiconductor Production [Dec 13, 2025]
[Dec 13, 2025] Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch ...
8008. Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA [Dec 13, 2025]
[Dec 13, 2025] Flip chip die bonder DA1201FC Flip Chip and Die AttachX/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin ...
8009. Automatic High Speed Epoxy Die Bonder Machine Manufacturer [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Die Bonding Machine System manufacturer Product Description Ultra High-Speed Silver Paste Die Bonder Unmatched Speed and Precision for Modern Semiconductor Assembly Introducing our fully automatic ...
8010. Advanced Laser Marking System for Precision Wafer Solutions [Dec 13, 2025]
[Dec 13, 2025] High Standard UV Laser Marking Machine for Food, PVC Pipe, Medicine Packaging Material Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, ...
