Jiangsu Profile
Product List
14686. Manual Operation Fluorine Lined Butterfly Semiconductor Valve Wcb Wafer Soft Sealed Acid Alkali Mfr ... 
[Jul 15, 2025]
[Jul 15, 2025] Product Description Fluorine-Lined Butterfly Valves Product Name Fluorine-Lined Butterfly Valves Nominal Diameter 1-1/2"~28" Nominal Pressure 150Lb Applicable Temperature -20°C to 120°C Applicable ...
14687. Soft Sealed Centerline Butterfly Semiconductor Valve Manual Wcb Wafer Type Fluorine Lined for Acid ... [Jul 15, 2025]
[Jul 15, 2025] Product Description Fluorine-Lined Butterfly Valves Product Name Fluorine-Lined Butterfly Valves Nominal Diameter 1-1/2"~28" Nominal Pressure 150Lb Applicable Temperature -20°C to 120°C Applicable ...
14688. Factory Supply Manual Butterfly Semiconductor Valve Wcb Wafer Soft Sealed Fluorine Lined for ... [Jul 15, 2025]
[Jul 15, 2025] Product Description Fluorine-Lined Butterfly Valves Product Name Fluorine-Lined Butterfly Valves Nominal Diameter 1-1/2"~28" Nominal Pressure 150Lb Applicable Temperature -20°C to 120°C Applicable ...
14689. Customized Industrial Grade Butterfly Semiconductor Valve Manual Wcb Fluorine Lined Wafer Soft ... [Jul 15, 2025]
[Jul 15, 2025] Product Description Fluorine-Lined Butterfly Valves Product Name Fluorine-Lined Butterfly Valves Nominal Diameter 1-1/2"~28" Nominal Pressure 150Lb Applicable Temperature -20°C to 120°C Applicable ...
14690. Custom Made High Temperature Quartz Glass Tube Polished Clear Quartz Tube for Semiconductor and ... [Feb 25, 2026]
[Feb 25, 2026] Company Profile Runlai Quartz Technology Lianyungang Runlai Quartz Technology Co., Ltd. is committed to the R&D, manufacturing and sales of quartz products. We have obtained ISO certification, and are only one hour away ...
14691. Custom Specification Fused Silica Quartz Tube High Temperature Resistant Clear Quartz Tube for ... [Feb 25, 2026]
[Feb 25, 2026] Company Profile Runlai Quartz Technology Lianyungang Runlai Quartz Technology Co., Ltd. is committed to the R&D, manufacturing and sales of quartz products. We have obtained ISO certification, and are only one hour away ...
14692. Custom Size High Purity Fused Quartz Glass Tube Fire Polished Heat Resistant Quartz Tube for ... [Feb 25, 2026]
[Feb 25, 2026] Company Profile Runlai Quartz Technology Lianyungang Runlai Quartz Technology Co., Ltd. is committed to the R&D, manufacturing and sales of quartz products. We have obtained ISO certification, and are only one hour away ...
14693. High Purity Transparent Fused Quartz Glass Tube Fire Polishing Heat Resistant Custom Size ... [Feb 25, 2026]
[Feb 25, 2026] Company Profile Runlai Quartz Technology Lianyungang Runlai Quartz Technology Co., Ltd. is committed to the R&D, manufacturing and sales of quartz products. We have obtained ISO certification, and are only one hour away ...
14694. Precision Temperature and Humidity Oven for Semiconductor Production [Mar 02, 2026]
[Mar 02, 2026] Product Description High temperature vacuum oven Large vacuum drying oven designed for various purposes of vacuum drying. Leave space for installing the vacuum pump. It adopts quick connection flange piping method and ...
14695. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
14696. Advanced Fully Automatic Die Bonding Machine for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
14697. Advanced Automated Back Grinding Machine for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
14698. Advanced Fully Automatic Semiconductor Molding System with Quick Mold Change [Feb 28, 2026]
[Feb 28, 2026] Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 inch touch screen+touch ...
14699. Advanced High Precision Die Bonder for Semiconductor Packaging [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
14700. Nai-Lok UHP 3/4 to 4 Inch Stainless Steel 316L Seamless Welding Tee for Semiconductor and Specialty ... [Feb 09, 2026]
[Feb 09, 2026] NAI-LOK UHP 3/4 to 4 Inch Stainless Steel 316L Seamless Welding Tee for Semiconductor and Specialty Gases Bpe Bend Fitting Product Description A fitting or adapter is used in semi-conductor industry, aero-space ...
