Jiangsu Profile
Product List
14401. Clear Laser Boring UV Round Semiconductor Quartz Glass Wafer 
[Dec 19, 2025]
[Dec 19, 2025] Product Description 1.Wholesale Optical Customized Clear Laser Boring Fused Silica High Transmittance UV Round Semiconductor Quartz Glass Wafer 2.High light transmission is more than 85% for UV lamp High ...
14402. Porous Vision Inspection Wafer Suction Disc Semiconductor Vacuum Adsorption Disc [Dec 19, 2025]
[Dec 19, 2025] Porous Alumina Ceramic Infiltrating Irrigation Cups,The application of porous ceramics in irrigation is a new trend.While improved irrigation efficiency, and environmentalprotection, non - toxic and harmless ...
14403. Customized Semiconductor Insulation Substrate 96% Alumina Plate Al2O3 Ceramic Wafer [Dec 18, 2025]
[Dec 18, 2025] Product Description Alumina ceramics have high hardness, high wear resistance, excellent electrical insulation and chemical stability, good heat resistance, excellent dielectric property, high thermal conductivity and ...
14404. Wit-1fully Automatic Intelligent Sample Preparation System for PCB Semiconductor [Nov 26, 2025]
[Nov 26, 2025] Model WIT-1 Input Electricity 220VAC,20A Compressed air Pressure> 0.6MPa External water connection Water pressure< 0.3MPa Sample Mounting Box Square shape Three different specifications are ...
14405. Wit-1fully Automatic Intelligent Sample Preparation System for Semiconductor [Nov 26, 2025]
[Nov 26, 2025] Model WIT-1 Input Electricity 220VAC,20A Compressed air Pressure> 0.6MPa External water connection Water pressure< 0.3MPa Sample Mounting Box Square shape Three different specifications are ...
14406. Premium Semiconductor Ovens for Cleanroom Efficiency and Quality [Dec 15, 2025]
[Dec 15, 2025] Other Specification Heating mode 26kw 780L × 1 branch Model structure Single door design, the control box is located above the machine Insulation material The use of insulation cotton, six-sided ...
Company: Kunshan Fanqi Machinery Co., LTD
14407. High-Performance Flip Chip Die Bonder for Semiconductor Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Category Specification Model SHD8120 Loading Method Wafer stacking and tray Bonding Method Epoxy Bonding Precision X/Y ≤ ...
14408. Innovative Automatic Laminator for Enhanced Semiconductor Substrate Production [Dec 13, 2025]
[Dec 13, 2025] Product Description Certification ISO Warranty 1 year Automatic Grade Automatic Installation Vertical Driven Type Electricity + Pneumatic Function Automatical Production Automatic substrate laminating machine is our ...
14409. Precision Welding and Bonding System for Semiconductor Devices [Dec 13, 2025]
[Dec 13, 2025] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
14410. High Precision LED Die Bonding Machine for Semiconductor Packaging [Dec 13, 2025]
[Dec 13, 2025] Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or ...
14411. Advanced Front End Ion Implanter for Precision Semiconductor Manufacturing Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description 1. Product overview Ion implanter is one of the high pressure small accelerators with the largest number of applications. It is the ion source to obtain the required ions, after the acceleration ...
14412. Cleanroom Teardrop Lamp 30W White Light 3000lm Ra80 for Semiconductor PF0.95 130lm/W [Nov 19, 2025]
[Nov 19, 2025] Company Profile Jiangsu Chuangxu Optoelectronics Co, Ltd Focus on Lighting Solution Chuangxu is a national high-tech enterprise focusing on clean room lighting products, integrating design, research and ...
Company: Jiangsu ChuangXu Optoelectronics Technology Co., Ltd.
14413. Professional OEM Anodized Aluminum Heat Sink for High Power Semiconductor Electronics [Sep 13, 2025]
[Sep 13, 2025] Product name Aluminum Heatsink Surface treatment Anodize Finish (CNC) Material Alloy 6063/6061/6005/6060 T1-T6 Deep process Punching Driling Precison Cutting Standard GBT14846-2008 GB5237-2008Sta certification ...
14414. Peek Components for Semiconductor & Optical Coating Equipment - OEM & Replacement [Sep 04, 2025]
[Sep 04, 2025] Medical grade PEEK seals with FDA compliance certifications In the petrochemical industry, the key advantage of polymer materials lies in their exceptional corrosion resistance, enabling them to withstand acids, ...
14415. Semiconductor Electronics Automotive Repair Stationary Variable Frequency Drive Closed Type ... [Aug 18, 2025]
[Aug 18, 2025] Product Description This permanent magnet VFD air compressor features a breakthrough IPM motor (IE5 efficiency) with stepless 0-100% speed regulation, delivering 50% energy savings and 37% lower lifecycle costs versus ...
