Jiangsu Profile
Product List
14431. Clear Drilled Laser Perforated Semiconductor Square Quartz Glass Plate 
[Dec 19, 2025]
[Dec 19, 2025] Product Description 1.Customized optical JGS1 JGS2 Clear Drilled Laser Perforated Semiconductor Square Quartz Glass Plate 2.Quartz plate/round quartz disc/quartz sight glass discperating temperature is ...
14432. Both Sides Grind Customize Frosty Fused Silica Quartz Glass Flange for Semiconductor [Dec 19, 2025]
[Dec 19, 2025] Both sides grind Customize Frosty Fused Silica Quartz Glass Flange for semiconductor Processing technology of frosty quartz glass flange: both sides grind, one side grind The purity of frosty silica quartz flange is ...
14433. High Precision Stainless Steel Plate for Semiconductor Equipment [Nov 26, 2025]
[Nov 26, 2025] Product Description Product Stainless Stee Plate Surface Finish BA, 2B, 2D, 4K, 6K, 8K, NO.4, HL, Embossed Technique Hot Rolled / Cold Rolled Standard GB JIS ASTM ASME EN Steel Grade 200 series: 201 202 300 series: 301 ...
14434. Advanced Cleanroom Ovens for Electronics and Semiconductor Use [Dec 16, 2025]
[Dec 16, 2025] Product Description Other Specification Heating mode 26kw 780L × 1 branch Model structure Single door design, the control box is located above the machine Insulation material The use of insulation ...
Company: Kunshan Fanqi Machinery Co., LTD
14435. Fully Automatic Laser Grooving Equipment for Semiconductor Wafers [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Laser Grooving Equipment for Semiconductor Wafers This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type ...
14436. Advanced Fully Automatic Vertical Vacuum Oven for Semiconductor Drying [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...
14437. Advanced Semiconductor Packaging Die Attach Bonder for Precision Assembly [Dec 13, 2025]
[Dec 13, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
14438. Semiconductor Equipment Wafer Loading and Unloading Wafer Mounter Dicing Turret Handler [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
14439. Djj-120 Automatic Chamfering Machine for Semiconductor Wafer [Dec 13, 2025]
[Dec 13, 2025] Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering Machine In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining high ...
14440. Advanced Fully Automatic Laser Peeling Machine for Semiconductor Applications [Dec 13, 2025]
[Dec 13, 2025] High End Semiconductor Fully Automatic Llo Laser Peeling Machine Product Description High-End Semiconductor Fully Automatic LLO Laser Lift-Off Machine Product Overview This system is a fully automated laser lift-off ...
14441. Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
14442. Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...
14443. Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
14444. China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports 1X2,1X4,2x2,2x4 Index time <400ms UPH ...
14445. Efficient Turret System for Semiconductor Chip Handling Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
