Jiangsu Profile
Product List
14461. Electrophoresis Anti Scratchoem Aluminum Extrusin Heat Sink Profilesfor High Power Semiconductor ... 
[Jul 30, 2025]
[Jul 30, 2025] Electrophoresis Anti ScratchOEM Aluminum Extrusin Heat Sink ProfilesFor High Power Semiconductor Electronics Fanless Heatsink Product Description Aluminum heat sink extrusion is the most common process and cost ...
14462. Silvery Sandblast Anodized Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor ... [Jul 16, 2025]
[Jul 16, 2025] Silvery Sandblast Anodized Aluminum Extrusion Heat Sink Profiles For High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal ...
14463. Black Bright Anodized Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics [Jul 16, 2025]
[Jul 16, 2025] Black Bright Anodized Aluminum Extrusion Heat Sink Profiles For High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution ...
14464. Champagne Anodized OEM Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor ... [Jul 15, 2025]
[Jul 15, 2025] Champagne Anodized OEM Aluminum Extrusion Heat Sink Profiles For High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution ...
14465. Electrophoresis Anti Scratch Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor ... [Jul 15, 2025]
[Jul 15, 2025] Electrophoresis Anti Scratch Aluminum Extrusion Heat Sink Profiles For High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal ...
14466. High Precision Semiconductor Machines Parts CNC Five Axis Linkage Machining Peek CNC Machining ... [Jul 14, 2025]
[Jul 14, 2025] Product Description CNC Machining Fabrication is a manufacturing process that involves high-precision cutting, molding, and assembling of metals, plastics, and other materials through computer-program-controlled ...
Company: BSD Machinery Co., Ltd.
14467. OEM Bright Anodized Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics [Jul 14, 2025]
[Jul 14, 2025] OEM Bright Anodized Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for ...
14468. Silvery Sandblast Anodized /Polished High Power Semiconductor Electronicsaluminum Extrusion ... [May 07, 2025]
[May 07, 2025] Silvery Sandblast Anodized /Polished High Power Semiconductor ElectronicsAluminum Extrusion Profiles For Connector Box / Shell Product Description MetalPlus manufacture a wide range of high quality and customized ...
14469. PA66 Conductive ESD-Safe Material for Semiconductor Packaging - Competitive Price [Mar 24, 2025]
[Mar 24, 2025] Product Description Introducing our GF15 Reinforced Nylon 66 Resin Injection Grade Plastic! Looking for a high-quality engineering plastic that offers exceptional rigidity, hardness, and thermal dimensional ...
Company: Suzhou Furenxiang Trade Co., Ltd.
14470. Sand Blast Bright Black Anodizing 6063 T5 High Power Semiconductor Electronics Heat Sink [Mar 01, 2025]
[Mar 01, 2025] Sand Blast Bright Black Anodizing 6063 T5 High Power Semiconductor Electronics Heat Sink Product Description Aluminum heat sink extrusion is the most common process and cost efficient thermal solution for most ...
14471. Reverse Osmosis Water Purification Equipment Water Purifier for Electronics and Semiconductors [Feb 26, 2025]
[Feb 26, 2025] What is the principle of reverse osmosis device? The principle of reverse osmosis devices is to purify water by physically and chemically filtering out suspended particles, dissolved substances, and ions in the ...
Company: Yancheng Olap Water Purification Equipment Technology Co., Ltd.
14472. High Precision Fabrication Steel Mould Small Slots Optical Profile Grinding Tie Bar Cut Dies for ... [Aug 23, 2024]
[Aug 23, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
14473. Dlc Coating Small Profile Grinding Teeth Carbide Tie Bar Cut Dies for Semiconductor Stamping [Aug 22, 2024]
[Aug 22, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
14474. Long Service High Speed Stamping Profile Grinding Wire Sinker EDM Mould Spare Parts for ... [Aug 20, 2024]
[Aug 20, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
14475. Customized Photo Chemical Etching Stainless Steel and Copper Leadframes for Semiconductors [Jul 24, 2024]
[Jul 24, 2024] Customized Photo Chemical Etching Stainless Steel and Copper leadframes For Semiconductors 1. Photo Etched Plate: Photo Etching is also called metal etching, chemical etching, chemical milling, photo etching, ...
