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The Role of Alumina Powder in Next-Gen Semiconductor Manufacturing
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14656.

The Role of Alumina Powder in Next-Gen Semiconductor Manufacturing Open Details in New Window [Sep 27, 2025]

Alumina Powder - The Foundation of Many Types of Ceramics Alumina powder serves as the cornerstone of many types of ceramics, such as engineered ceramics. Due to its resistance to both heat and chemical reactions, this ...

Company: Suzhou Daduo Science and Technology Co., Ltd.

High End Semiconductor Fully Automatic Laser Ring Cutting Machine
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14657.

High End Semiconductor Fully Automatic Laser Ring Cutting Machine Open Details in New Window [Oct 16, 2025]

Product Description catalogue 1, Introduction to UV-CT Silicon Wafer UV Cutting Machine 2, Introduction to Dazu Laser Company 3, Basic configuration list 1, Introduction to Silicon Wafer UV Laser Cutting ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High End Semiconductor Fully Automatic Llo Laser Peeling Equipment
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14658.

High End Semiconductor Fully Automatic Llo Laser Peeling Equipment Open Details in New Window [Oct 16, 2025]

Product Description Using pulsed laser radiation with photon energy greater than GaN bandgap and smaller than sapphire bandgap to irradiate sapphire substrate, GaN is thermally decomposed into nitrogen gas and low ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
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14659.

Fully Automatic Laser Grooving Equipment for Semiconductor Wafers Open Details in New Window [Sep 18, 2025]

Fully Automatic Laser Grooving Equipment for Semiconductor Wafers This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate
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14660.

High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate Open Details in New Window [Sep 18, 2025]

Product Description Single machine plastic sealing equipment 1, Main parameters of the equipment 1. Mold closing pressure: 98-1176kN. 2. Injection pressure: 1-29.4kN. 3. Applicable lead frame/substrate size: width ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Copper Layer Electrochemical Stripping System
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14661.

Semiconductor Copper Layer Electrochemical Stripping System Open Details in New Window [Sep 18, 2025]

Corrosion Stripping Copper Equipment refers to industrial systems designed to selectively remove copper layers or corrosion products from substrates through chemical, electrochemical, or plasma-assisted processes. These ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Dbc Sintering Furnace for High Temperature Heat Treatment of Power Semiconductor Devices
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14662.

Dbc Sintering Furnace for High Temperature Heat Treatment of Power Semiconductor Devices Open Details in New Window [Sep 18, 2025]

Dbc Sintering Furnace for High Temperature Heat Treatment of Power Semiconductor Devices Product Description 1. Technical indicators The use of temperature RT-1100 C. The uniformity of the furnace is better than that of ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
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14663.

Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach Open Details in New Window [Sep 18, 2025]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

C300 Single Wafer Ald Semiconductor Equipment Is Mainly Used for Metal Gate
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14664.

C300 Single Wafer Ald Semiconductor Equipment Is Mainly Used for Metal Gate Open Details in New Window [Sep 18, 2025]

Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Wafer Handling Robot Cleanroom Compatible Bearings
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14665.

Semiconductor Wafer Handling Robot Cleanroom Compatible Bearings Open Details in New Window [Sep 09, 2025]

Product Description YIYE Bearings: Precision Engineered for Optimal Performance YIYE offers a comprehensive range of meticulously designed bearings for diverse industrial needs. Crafted with precision, utilizing ...

Company: Jiangsu Yiye Metallurgical Technology Co., Ltd.

ODM OEM Monocrystalline 6 8 12 Inch Film Wafer Frame with Dura420 SUS420J2 Materials for ...
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14666.

ODM OEM Monocrystalline 6 8 12 Inch Film Wafer Frame with Dura420 SUS420J2 Materials for ... Open Details in New Window [Aug 22, 2025]

ODM OEM Monocrystalline 6 8 12 Inch Film Wafer Frame with Dura420 SUS420J2 Materials for Semiconductor Product Description Product Name 6" 8" 12" steel Metal Wafer Frame Ring For ...

Company: Wuxi Jinbao Special Steel Co., Ltd.

100% Polyester Dust Free Clean Room Note Book for Semiconductor Production Lines
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14667.

100% Polyester Dust Free Clean Room Note Book for Semiconductor Production Lines Open Details in New Window [Aug 05, 2025]

100% Polyester Dust Free Clean Room Note Book for Semiconductor Production Lines Dust-free notebook: The clean room notebook is made of dust-free paper, which can significantly reduce the generation of dust; the ...

Company: Suzhou Qiangsheng Clean Technology Co., Ltd.

Black Customized High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink
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14668.

Black Customized High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink Open Details in New Window [Jul 25, 2025]

Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...

Company: Jiangsu Goldsun Winwin Global Trade Co., Ltd.

Custom Small High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink
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14669.

Custom Small High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink Open Details in New Window [Jul 25, 2025]

Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...

Company: Jiangsu Goldsun Winwin Global Trade Co., Ltd.

Semiconductor Stainless Steel 304 316L 321 Kf25 Kf40 Metal Clamp Vacuum Hose Vacuum Bellows
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14670.

Semiconductor Stainless Steel 304 316L 321 Kf25 Kf40 Metal Clamp Vacuum Hose Vacuum Bellows Open Details in New Window [Jul 17, 2025]

Semiconductor stainless steel KF25 KF40 metal clamp vacuum hose vacuum bellows Product Description Bellows are used as sealing parts, widely usedin chemical industry or vacuum systemn, hightemp or high -riskfluids, as ...

Company: Comflex Industrial Co., Ltd.