Jiangsu Profile
Product List
14221. Customized Sheet Metal Enclosures for Semiconductor, Medical, and Aerospace Industries 
[Oct 21, 2025]
[Oct 21, 2025] We can produce aerospace metal parts, semiconductor metal parts, agricultural metal parts, medical metal parts, mechanical metal parts, automation metal parts, aluminum metal parts, and drone parts. Copper metal parts ...
14222. High Precision Medical Semiconductor, Aerospace, Unmanned Aerial Vehicles, Agriculture, Energy, ... [Oct 21, 2025]
[Oct 21, 2025] Product Description CUSTOM SHEET METAL FABRICATION PART Our custom sheet metal fabrication parts deliver precision-engineered solutions tailored to your specific industrial requirements. Each part is crafted from ...
14223. Efficient and High-Quality Customized Sheet Metal Parts for Semiconductor Aviation Medical Energy [Oct 21, 2025]
[Oct 21, 2025] Product Description CUSTOM SHEET METAL FABRICATION PART Our custom sheet metal fabrication parts deliver precision-engineered solutions tailored to your specific industrial requirements. Each part is crafted from ...
14224. Zero Error Aerospace Medical Semiconductor Medical Energy Agricultural Sheet Metal Parts [Oct 21, 2025]
[Oct 21, 2025] Product Description CUSTOM SHEET METAL FABRICATION PART Our custom sheet metal fabrication parts deliver precision-engineered solutions tailored to your specific industrial requirements. Each part is crafted from ...
14225. Customized Aviation Sheet Metal Semiconductor Medicaldrone Metal Parts [Oct 21, 2025]
[Oct 21, 2025] We can produce aviation metal parts, semiconductor metal parts, agricultural metal parts, medical metal parts, mechanical metal parts, automation metal parts, aluminum metal parts, copper metal parts, and other metal ...
14226. European Standard Copper Plate Bending Machine for Semiconductor Industry [Oct 21, 2025]
[Oct 21, 2025] The copper materials we process include brass, tin bronze, aluminum bronze, and lead brass, which have a wide range of applications in fields such as drone casings, medical aviation, agriculture, and semiconductor ...
14227. 12-Inch Stainless Steel Monocrystalline Film Semiconductor Metal Frame Wafer Ring for Semiconductor ... [Sep 25, 2025]
[Sep 25, 2025] 12-Inch Stainless Steel Monocrystalline Film Semiconductor Metal Frame Wafer Ring for Semiconductor Devices Product Description Product Name 6" 8" 12" steel Metal Wafer Frame Ring For ...
Company: Wuxi Jinbao Special Steel Co., Ltd.
14228. Stainless Steel CNC Turning Service Custom Machining for Semiconductors Device Parts [Sep 20, 2025]
[Sep 20, 2025] Product Description CNC TURNING MACHINE SERVICE CNC lathes, the ultimate embodiment of precision engineering, represent a pinnacle of technological mastery. These extraordinary machines are meticulously programmed ...
14229. Semiconductor Devices Automatic High-Speed Lead Wire Welding and Bonding Machine [Sep 18, 2025]
[Sep 18, 2025] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
14230. Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing [Sep 18, 2025]
[Sep 18, 2025] Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...
14231. High Precision Semiconductor Chip Eutectic Wafer Turret Loading and Unloading Machine [Sep 18, 2025]
[Sep 18, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
14232. Fully Automatic Vacuum Vertical Oven Used in Semiconductor and Pan-Semiconductor Processes [Sep 18, 2025]
[Sep 18, 2025] Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...
14233. Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System [Sep 18, 2025]
[Sep 18, 2025] Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ...
14234. Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China [Sep 18, 2025]
[Sep 18, 2025] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
14235. Semiconductor Equipment Wafer Loading and Unloading Wafer Mounter Dicing Turret Handler [Sep 18, 2025]
[Sep 18, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
