Jiangsu Profile
Product List
14161. Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach 
[Mar 19, 2025]
[Mar 19, 2025] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
14162. Industry High-End Semiconductor Fully Automatic Wafer Marking Machine [Mar 19, 2025]
[Mar 19, 2025] Product Description 1. Product size compatibility: 8-12 inch bare wafer; 2. Equipped with a wafer loading system called Loadport, supporting FOUP loading; 3. Robot robotic arm film transmission; 4. Automatic ...
14163. High Precision Eutectic &Exopy Die Attach Die Bonder Die Bonding Machine for Semiconductor Industry [Mar 17, 2025]
[Mar 17, 2025] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
14164. Fully Automatic Laser Grooving Equipment for Semiconductor Wafers [Mar 13, 2025]
[Mar 13, 2025] Fully Automatic Laser Grooving Equipment for Semiconductor Wafers This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type ...
14165. #Nailok UHP SS316L Regulator 0-150psi Outlet Pressure Sinlge 1/4"Female Pressure Reducing Valve ... [Mar 13, 2025]
[Mar 13, 2025] 3000psi SS316 Stainless Steel Diaphragm Valve The structure of the diaphragm valve is very different from that of ordinary valves. It is a new type of valve and a special type of block valve. Its opening and closing ...
14166. Semiconductor Devices Automatic High-Speed Lead Wire Welding and Bonding Machine [Feb 28, 2025]
[Feb 28, 2025] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
14167. Customized Design Hot Sale Semiconductor Equipment Wafer Scrubber [Feb 28, 2025]
[Feb 28, 2025] Product Description This series comprises special cleaning machines for wafers after polishing. They integrate automatic loading and unloading systems, double-sided PVA scrubbing, mega-sonic cleaning, spin drying & ...
14168. Factory Direct Sales Fully Automatic High-Precision Semiconductor Wafer Laser Grooving Machine [Feb 28, 2025]
[Feb 28, 2025] This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates ...
14169. High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate [Feb 26, 2025]
[Feb 26, 2025] Product Description Single machine plastic sealing equipment 1, Main parameters of the equipment 1. Mold closing pressure: 98-1176kN. 2. Injection pressure: 1-29.4kN. 3. Applicable lead frame/substrate size: width ...
14170. Zeolite Concentrator Concentrating System for Spray Painting, Printing, Electronic Sintering, ... [Feb 26, 2025]
[Feb 26, 2025] Product Description 1,Scope of application The organic waste gas flow rate is higher than 10000 Nm3/h; Concentration 300-1500 mg/m3; Subsequent direct combustion furnace, RTO or CO treatment are suitable for ...
14171. C300 Single Wafer Ald Semiconductor Equipment Is Mainly Used for Metal Gate [Feb 25, 2025]
[Feb 25, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is ...
14172. Semiconductor Packaging Equipment Package Bonder for Tcb Ncp/Ncf/Tc-Cuf C2 and C4 and Fo-Wlp ... [Feb 25, 2025]
[Feb 25, 2025] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
14173. Semiconductor Equipment Automatic Film Arrangement Machine with Safety Protection System [Feb 25, 2025]
[Feb 25, 2025] Product Description Main Features Equipment function: Using a robotic arm to automatically grasp and discharge the lead frame; Applicable packaging: all packaging; Control system: PLC (Omron) Operating system: ...
14174. Vacuum Oven Chip Semiconductor Equipment Adopts The Digital Technology of Analog Engineering to ... [Feb 25, 2025]
[Feb 25, 2025] Product Description Vacuum oven for chip semiconductor The vacuum oven for Jardine Chip Semiconductor adopts the digital technology of analog engineering to control the vacuum degree, and the automatic digital display ...
14175. Stainless Steel Air Filter Cartridge for Semiconductor Factory [Feb 22, 2025]
[Feb 22, 2025] Standard Types Of Cartridge Filters; Cpas & Inner Core; Finished Filters; Cellulose Paper/Polyester Dust Collector Air Filter Cartridge For Industrial Air Cleaning: A:Compact design, reliable ...
