Jiangsu Profile
Product List
6706. S40541 S4054W S4054y FUJI Cp6 Sensor Hpf-S054-a (0.55M) 
[May 04, 2018]
[May 04, 2018] Part No: S40541 S4054W S4054Y Description: FUJI CP6 SENSOR HPF-S054-A(0.55M) Condition: Original New and used ones are availble! Lead time: in stock! Payment: Paypal, Western Union, T/T are allowed. If you are ...
Company: SMT PARTS SUPPLY LTD
6707. Efficient 5W Blue Laser Engraver for Streamlined Crafting Processes [Jul 14, 2026]
[Jul 14, 2026] Product Description STARCRAFT AEROSPACE A7 Mini PRO Laser Engraver: Precision Engineering for Desktop Manufacturing Compact laser solution for makers, educators, and workshops with aviation-grade performance. Key ...
6708. High-Quality 1045 Steel Piston Rod for Precision Engineering [Jul 22, 2026]
[Jul 22, 2026] Name: Cold drawn 1045 steel chromed piston rods Key Words: Steel Rod bar, Stainless Steel Bar, Steel Chromed Bar, Steel Chromed piston rod 304, 304L, 316, 316L, 310,310S, 2205, 416, 2607, 630 etc. Standard : ASTM ...
6709. Precision Silicone Dispenser for Effortless and Clean Use [Jul 23, 2026]
[Jul 23, 2026] Product Description Certification CE Warranty 1 year Automatic Grade Automatic Installation Desktop Driven Type Electricity + Pneumatic Function Automatical Production Detailed Photos Dispensing ...
6710. Precision Alignment Tools for IC Wafer Performance Optimization [Jul 21, 2026]
[Jul 21, 2026] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
6711. High-Precision 12-Inch Wafer Dicing Saw for Silicon & Ceramics [Jul 21, 2026]
[Jul 21, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution The DS9260 is a 12-inch fully automatic precision dicing machine, featuring a high-power dual-spindle design and equipped with a ...
6712. Advanced Semiconductor Bonding Solutions for 6 to 10 Inch Devices [Jul 21, 2026]
[Jul 21, 2026] Product Description Product Introduction: The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving ...
6713. High-Precision 20W Fiber Laser Engraver for PCB Marking and Customization [Jul 20, 2026]
[Jul 20, 2026] Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...
6714. Reliable UV Picosecond Laser Machine with CE for Sapphire Wafer Micro Machining [Jul 20, 2026]
[Jul 20, 2026] Reliable UV Picosecond Laser Machine with CE for Sapphire Wafer Micro Machining This machine adopts UV picosecond ultrafast laser cold ablation technology with a pulse width below 10ps, specially designed for ...
6715. Picosecond Glass Laser Cutting Splitting Machine for Optical Glass [Jul 16, 2026]
[Jul 16, 2026] Picosecond Glass Laser Cutting Splitting Machine for Optical Glass CHANXAN specializes in ultra-precise cold processing for brittle materials including glass, ceramics, semiconductors and sapphire. We deliver ...
6716. High-Precision Fiber Laser Cutter for HVAC Ducts and Aluminum [Jul 16, 2026]
[Jul 16, 2026] Detailed Photos MAIN PARTS Machine Bed Steel Pipe Welded Fiber Laser Source ,Max Cutting Head Raytools brand BT220-2D Ncstudio Servo Motor and ...
Company: Nanjing Unitec Technology Co., Ltd.
6717. Advanced 30W Picosecond Laser Cutter for Sapphire Glass [Jul 16, 2026]
[Jul 16, 2026] Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, automated ...
6718. High-Precision 80W Mopa Laser Scribing Machine for Wafer Processing [Jul 16, 2026]
[Jul 16, 2026] Product Description High-Precision Laser Scribing Machine for Superior Wafer Yield Our SHL2-4000V19 Laser Scribing Machine represents the pinnacle of efficiency and precision in solar cell production. Designed for ...
6719. Advanced Wafer Laser Lift-off System for GaN Layer Separation [Jul 15, 2026]
[Jul 15, 2026] Product Description SLO-V3080A LED Laser Lift-Off Equipment The SLO-V3080A is a state-of-the-art laser lift-off (LLO) system engineered for high-volume, high-yield production of LED devices. It is designed to perform ...
6720. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Jul 15, 2026]
[Jul 15, 2026] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
