Jiangsu Profile
Product List
6796. Premium Virgin PTFE Cleaning Basket for Semiconductor Wafer Processing 
[Jul 13, 2026]
[Jul 13, 2026] Product Description Technical Index Unit Value Specific Gravity g/cc 2.15-2.20 Tensile Strength Pa (1,961-3,521)x 10000 Elongation at Break % 250-500 Compressive Strength (10% deformation) Pa 19.52 x1000000 Impact ...
Company: Zhenjiang Hansa Sealant Co., Ltd.
6797. High-Precision GaN Wafer Laser Dicing System for Semiconductors [Jul 13, 2026]
[Jul 13, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
6798. Advanced Grinding Technologies for Precision Wafer Thinning Processes [Jul 13, 2026]
[Jul 13, 2026] Product Description High precision grinding machine equipment principle: 1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the ...
6799. Factory RF CO2 Laser Cutting Machine for FPC PCB Flexible Film CE [Jul 13, 2026]
[Jul 13, 2026] Factory RF CO2 Laser Cutting Machine for FPC PCB Flexible Film CE CHANXAN RF CO2 laser cutting machines perfectly meet strict precision and yield standards for consumer 3C electronics, including mobile phones, wearable ...
6800. High-Precision UV Laser Cutter for OLED Film Manufacturing [Jul 13, 2026]
[Jul 13, 2026] Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, ...
6801. Advanced Manual Wafer Film Mounter for LED and PCB Applications [Jul 16, 2026]
[Jul 16, 2026] Product Description The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving design significantly ...
6802. High Precision Ultrafast Laser Cutting Machine for Semiconductor Wafer & 3c Cover Glass [Jul 10, 2026]
[Jul 10, 2026] ULTRAFAST GLASS LASER CUTTING MACHINE FOR SEMICONDUCTOR WAFER & 3C COVER GLASS CHANXAN focuses on ultrafast cold precision processing for brittle fragile materials, covering semiconductor glass wafer, 3C cover glass, ...
6803. High Definition UV Laser Marking Machine for Cosmetic Bottles [Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6804. High Precision UV Laser Marking Machine for Fine Engraving [Jul 14, 2026]
[Jul 14, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
6805. Nanosecond Laser Cutting Machine with Linear Motor for Precision Thin Film Processing [Jul 09, 2026]
[Jul 09, 2026] Nanosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides Nanosecond laser cutting machines, with their core advantages of high precision, high stability, and wide material adaptability, are specifically ...
6806. Advanced Laser Marking Systems for Long-Lasting Metal and Plastic [Jul 08, 2026]
[Jul 08, 2026] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable marking on ...
6807. CNC Fiber Laser Scribing & Cutting Machine for Semiconductor Silicon Wafer Processing [Jul 07, 2026]
[Jul 07, 2026] HIGH PRECISION CNC FIBER LASER SCRIBING & CUTTING MACHINE FOR SEMICONDUCTOR SILICON WAFER CHANXAN CNC fiber laser scribing machine exclusively for semiconductor silicon wafer substrate processing. Core strengths: ...
6808. CNC Industrial Fiber Laser Cutting Machine for Semiconductor Ceramic Substrate Processing [Jul 07, 2026]
[Jul 07, 2026] HIGH PRECISION FIBER LASER CUTTING MACHINE FOR ADVANCED CERAMIC SUBSTRATES Chanxan specializes in micron-level cold ablation equipment for alumina, AlN and zirconia ceramic substrates. Core strengths: zero thermal ...
6809. Industrial Precision Fiber Laser Cutting Machine for Advanced Ceramic Substrate [Jul 06, 2026]
[Jul 06, 2026] HIGH PRECISION FIBER LASER CUTTING MACHINE FOR ADVANCED CERAMIC SUBSTRATES CHANXAN specializes in micron cold ablation equipment for alumina, AlN and zirconia ceramic substrates. Core strengths: zero thermal damage, ...
6810. Closed Precision Metal Fiber Laser Cutting Machine for Silicon Wafer Ceramic Substrate [Jul 06, 2026]
[Jul 06, 2026] CW-6060J Closed Precision Fiber Laser Cutting Machine CHANXAN CW-6060J fully enclosed fiber laser cutter is dedicated to semiconductor micro-processing. It adopts micron-level non-contact cold cutting technology with ...
