Jiangsu Profile
Product List
6646. High-Precision 12-Inch Wafer Dicing Saw for Silicon & Ceramics 
[Jul 21, 2026]
[Jul 21, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution The DS9260 is a 12-inch fully automatic precision dicing machine, featuring a high-power dual-spindle design and equipped with a ...
6647. Advanced Semiconductor Bonding Solutions for 6 to 10 Inch Devices [Jul 21, 2026]
[Jul 21, 2026] Product Description Product Introduction: The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving ...
6648. High-Precision 20W Fiber Laser Engraver for PCB Marking and Customization [Jul 20, 2026]
[Jul 20, 2026] Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...
6649. Reliable UV Picosecond Laser Machine with CE for Sapphire Wafer Micro Machining [Jul 20, 2026]
[Jul 20, 2026] Reliable UV Picosecond Laser Machine with CE for Sapphire Wafer Micro Machining This machine adopts UV picosecond ultrafast laser cold ablation technology with a pulse width below 10ps, specially designed for ...
6650. Easy to Use and Setup Atomstack A70max Laser Engraver Machine 70W [Jul 01, 2026]
[Jul 01, 2026] Product Description Easy to Use and Setup Atomstack A70max Laser Engraver Machine 70W Extreme Power, Unmatched Depth: Experience unparalleled performance with the A70MAX, boasting a formidable 77W laser output. ...
Company: Suzhou Tophee Tech Co., Ltd.
6651. Picosecond Glass Laser Cutting Splitting Machine for Optical Glass [Jul 16, 2026]
[Jul 16, 2026] Picosecond Glass Laser Cutting Splitting Machine for Optical Glass CHANXAN specializes in ultra-precise cold processing for brittle materials including glass, ceramics, semiconductors and sapphire. We deliver ...
6652. Daja DJ6 3W Laser Engraver Machine for Perfect for DIY & Small Business [Jun 30, 2026]
[Jun 30, 2026] Product Description DAJA DJ6 3w Laser Engraver machine for Perfect for DIY & Small Business Powerful Laser Caving Ability] The unique base design provides engraving stability and safety for the engraver. The aluminum ...
Company: Suzhou Tophee Tech Co., Ltd.
6653. High-Performance A70max Laser Engraver Machine One-Key Auto-Focus [Jun 30, 2026]
[Jun 30, 2026] Product Description High-Performance A70max Laser Engraver machine One-Key Auto-Focus Extreme Power, Unmatched Depth: Harness the sheer force and precision of the High-Performance A70MAX Laser Engraver Machine with ...
Company: Suzhou Tophee Tech Co., Ltd.
6654. 40W CO2 Portable Mini Laser Marking Printing Coding Engraving Machine [Jun 30, 2026]
[Jun 30, 2026] Product Description 40W CO2 Portable Mini Laser Marking Printing Coding Engraving Machine Mark Fast, Mark Accurate: CO2 Laser Flying Machine – Your Go-To for Plastic Expiry Date & Logo ...
Company: Suzhou Tophee Tech Co., Ltd.
6655. Daja DJ6 Portable Laser Engraver Machine Easy to Learn and Operate [Jun 30, 2026]
[Jun 30, 2026] Product Description DAJA DJ6 Portable Laser Engraver machine easy to learn and operate Powerful Laser Caving Ability] The unique base design provides engraving stability and safety for the engraver. The aluminum and ABS ...
Company: Suzhou Tophee Tech Co., Ltd.
6656. High-Precision Fiber Laser Cutter for HVAC Ducts and Aluminum [Jul 16, 2026]
[Jul 16, 2026] Detailed Photos MAIN PARTS Machine Bed Steel Pipe Welded Fiber Laser Source ,Max Cutting Head Raytools brand BT220-2D Ncstudio Servo Motor and ...
Company: Nanjing Unitec Technology Co., Ltd.
6657. Advanced 30W Picosecond Laser Cutter for Sapphire Glass [Jul 16, 2026]
[Jul 16, 2026] Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, automated ...
6658. High-Precision 80W Mopa Laser Scribing Machine for Wafer Processing [Jul 16, 2026]
[Jul 16, 2026] Product Description High-Precision Laser Scribing Machine for Superior Wafer Yield Our SHL2-4000V19 Laser Scribing Machine represents the pinnacle of efficiency and precision in solar cell production. Designed for ...
6659. Advanced Wafer Laser Lift-off System for GaN Layer Separation [Jul 15, 2026]
[Jul 15, 2026] Product Description SLO-V3080A LED Laser Lift-Off Equipment The SLO-V3080A is a state-of-the-art laser lift-off (LLO) system engineered for high-volume, high-yield production of LED devices. It is designed to perform ...
6660. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Jul 15, 2026]
[Jul 15, 2026] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
