Jiangsu Profile
Product List
16426. Bozhon Semiconductor Die Bonding Machine 
[Oct 16, 2023]
[Oct 16, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16427. Bozhon Semiconductor Die Attach Epoxy Machine [Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16428. Ts16949 Qualified OEM High Precision Parts Turning Milling Custom CNC Machining Service Accessories ... [Dec 04, 2024]
[Dec 04, 2024] Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...
16429. Jiangsu Factory Milling Machine Brass Aluminium Steel Iron Machining CNC Lathe Precision Machining ... [Dec 04, 2024]
[Dec 04, 2024] Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...
16430. Aluminum Plate Processing Semiconductor Machine Parts Turning CNC Machining Parts [May 17, 2024]
[May 17, 2024] Company Profile Item name CNC machining Tolerance minimum tolerance 0.005mm Material Titanium,Titanium alloy etc.We handle many other type of materials. Please contact us if your required material is not listed ...
16431. Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ... [Jan 25, 2024]
[Jan 25, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16432. Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16433. Domestic Semiconductor High-Precision Chip Eutectic Machine Supports Gel-Pak Feeding Device [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16434. Integrated Hot Press Bonding Function Semiconductor High-Speed and High-Precision Solidification ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16435. Semiconductor High-Precision Die Attch Provide Flexible Packaging Capabilities for Advanced ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16436. Self Developed Motion Control Technology for Domestic High-Precision Semiconductor Solidification ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16437. Domestic Semiconductor Fully Automatic High-Speed and High-Precision Solidification Machine ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16438. Domestic Star Standard Series Semiconductor Optical 3D Aoi Testing Equipment [Jan 10, 2024]
[Jan 10, 2024] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16439. High Precision 3D Optical Testing Equipment for Semiconductor Chip Packaging [Jan 02, 2024]
[Jan 02, 2024] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16440. Semiconductor Leadscan Four Sided Optical Detection Equipment [Dec 11, 2023]
[Dec 11, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
