Jiangsu Profile
Product List
16486. Colored Cleanroom Industry Breathable Mask ESD Anti-Static Shawl Cap for Semiconductor 
[Aug 05, 2024]
[Aug 05, 2024] Colored Cleanroom Industry Breathable Mask ESD Anti-Static Shawl Cap for Semiconductor What service we can provide for our customers: 1. Meet customers' target price by adjust material or other details, ...
16487. Carbon Fiber Customized Aerospace Parts Semiconductor Parts Customization [Apr 07, 2025]
[Apr 07, 2025] With an impressive workforce of over 100 skilled internal employees, Suzhou Xuan Xin Technology Co., Ltd proudly boasts an annual output value surpassing 80 million yuan. Equipped with more than 60 state-of-the-art ...
Company: Suzhou Xuan Xin Technology Co., Ltd
16488. Semiconductor High Precision COB Smart Die Bonding Machine [Oct 07, 2023]
[Oct 07, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16489. Semiconductor Die Bonding Machine China Manufacturer [Sep 27, 2023]
[Sep 27, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16490. High End Die Bonder Equipment to Assist in Semiconductor Packaging [Dec 11, 2023]
[Dec 11, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16491. Bozhon Semiconductor Die Bonding Machine [Oct 16, 2023]
[Oct 16, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16492. Bozhon Semiconductor Die Attach Epoxy Machine [Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16493. Ts16949 Qualified OEM High Precision Parts Turning Milling Custom CNC Machining Service Accessories ... [Dec 04, 2024]
[Dec 04, 2024] Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...
16494. Jiangsu Factory Milling Machine Brass Aluminium Steel Iron Machining CNC Lathe Precision Machining ... [Dec 04, 2024]
[Dec 04, 2024] Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...
16495. Aluminum Plate Processing Semiconductor Machine Parts Turning CNC Machining Parts [May 17, 2024]
[May 17, 2024] Company Profile Item name CNC machining Tolerance minimum tolerance 0.005mm Material Titanium,Titanium alloy etc.We handle many other type of materials. Please contact us if your required material is not listed ...
16496. Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ... [Jan 25, 2024]
[Jan 25, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16497. Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16498. Domestic Semiconductor High-Precision Chip Eutectic Machine Supports Gel-Pak Feeding Device [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16499. Integrated Hot Press Bonding Function Semiconductor High-Speed and High-Precision Solidification ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16500. Semiconductor High-Precision Die Attch Provide Flexible Packaging Capabilities for Advanced ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
