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Semiconductor High-Precision Die Bonder Machine Made in China

16381.

Semiconductor High-Precision Die Bonder Machine Made in China Open Details in New Window [Dec 05, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

High Precision Eutectic Machine for Semiconductor Chips

16382.

High Precision Eutectic Machine for Semiconductor Chips Open Details in New Window [Dec 05, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Fully Automatic Optical Testing Equipment

16383.

Semiconductor Fully Automatic Optical Testing Equipment Open Details in New Window [Nov 28, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging

16384.

Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging Open Details in New Window [Nov 27, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging

16385.

Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging Open Details in New Window [Nov 27, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment

16386.

Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment Open Details in New Window [Nov 27, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Chip Placement Equipment High-Precision Dispensing Machine

16387.

Semiconductor Chip Placement Equipment High-Precision Dispensing Machine Open Details in New Window [Nov 22, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Power Semiconductor High-Precision Die Bonding Equipment

16388.

Power Semiconductor High-Precision Die Bonding Equipment Open Details in New Window [Nov 20, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Back-End Packaging and Bonding Placement Equipment

16389.

Semiconductor Back-End Packaging and Bonding Placement Equipment Open Details in New Window [Nov 17, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Die Bonding Machine China Equipment

16390.

Bozhon Semiconductor Die Bonding Machine China Equipment Open Details in New Window [Oct 09, 2023]

Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Submikron Semiconductor Die Bonding & Die Solder Machines

16391.

Submikron Semiconductor Die Bonding & Die Solder Machines Open Details in New Window [Oct 09, 2023]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Factory Customized Aluminum Parts Medical Semiconductor Parts Automation Turning and Milling ...

16392.

Factory Customized Aluminum Parts Medical Semiconductor Parts Automation Turning and Milling ... Open Details in New Window [Dec 11, 2023]

Our Advantages UE(user experience) Certifications CNC machining has entered this era of rapid development, many industries can use CNC machining, such as aviation, medical, automobile, motorcycle, ...

Company: Kunshan Deshengrui Machinery Co., LTD

Precision Turned-Milling Machining OEM/ODM Small CNC Turning Milling Parts for Swiss ...

16393.

Precision Turned-Milling Machining OEM/ODM Small CNC Turning Milling Parts for Swiss ... Open Details in New Window [Feb 26, 2024]

Model NO. Custom Parts Application Fastener, Auto and Motorcycle Accessories, Hardware Tool, Machinery Accessory Standard GB, EN, China GB Code, JIS Code, TEMA, ASME Surface Treatment Anodizing Production ...

Company: Kunshan Deshengrui Machinery Co., LTD

Advanced Carbon Fiber Medical Parts for Cutting-Edge Semiconductor Drones

16394.

Advanced Carbon Fiber Medical Parts for Cutting-Edge Semiconductor Drones Open Details in New Window [Apr 07, 2025]

Our esteemed company proudly boasts a dynamic team of over 100 skilled internal employees, generating an exceptional annual output value of more than 80 million yuan. Equipped with over 60 state-of-the-art main ...

Company: Suzhou Xuan Xin Technology Co., Ltd

Custom Carbon Fiber Medical Parts for Enhanced Semiconductor Drone Functionality

16395.

Custom Carbon Fiber Medical Parts for Enhanced Semiconductor Drone Functionality Open Details in New Window [Apr 07, 2025]

Our esteemed company boasts an impressive workforce of over 100 dedicated employees, generating an annual output value surpassing 80 million yuan. With an arsenal of more than 60 advanced production machines, our ...

Company: Suzhou Xuan Xin Technology Co., Ltd