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Domestic Star Standard Series Semiconductor Optical 3D Aoi Testing Equipment

16381.

Domestic Star Standard Series Semiconductor Optical 3D Aoi Testing Equipment Open Details in New Window [Jan 10, 2024]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

High Precision 3D Optical Testing Equipment for Semiconductor Chip Packaging

16382.

High Precision 3D Optical Testing Equipment for Semiconductor Chip Packaging Open Details in New Window [Jan 02, 2024]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Leadscan Four Sided Optical Detection Equipment

16383.

Semiconductor Leadscan Four Sided Optical Detection Equipment Open Details in New Window [Dec 11, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

High Precision Dispensing Equipment for Semiconductor Packaging Solutions

16384.

High Precision Dispensing Equipment for Semiconductor Packaging Solutions Open Details in New Window [Dec 06, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor High-Precision Die Bonder Machine Made in China

16385.

Semiconductor High-Precision Die Bonder Machine Made in China Open Details in New Window [Dec 05, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

High Precision Eutectic Machine for Semiconductor Chips

16386.

High Precision Eutectic Machine for Semiconductor Chips Open Details in New Window [Dec 05, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Fully Automatic Optical Testing Equipment

16387.

Semiconductor Fully Automatic Optical Testing Equipment Open Details in New Window [Nov 28, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging

16388.

Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging Open Details in New Window [Nov 27, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging

16389.

Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging Open Details in New Window [Nov 27, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment

16390.

Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment Open Details in New Window [Nov 27, 2023]

Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Chip Placement Equipment High-Precision Dispensing Machine

16391.

Semiconductor Chip Placement Equipment High-Precision Dispensing Machine Open Details in New Window [Nov 22, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Power Semiconductor High-Precision Die Bonding Equipment

16392.

Power Semiconductor High-Precision Die Bonding Equipment Open Details in New Window [Nov 20, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Back-End Packaging and Bonding Placement Equipment

16393.

Semiconductor Back-End Packaging and Bonding Placement Equipment Open Details in New Window [Nov 17, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Die Bonding Machine China Equipment

16394.

Bozhon Semiconductor Die Bonding Machine China Equipment Open Details in New Window [Oct 09, 2023]

Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Submikron Semiconductor Die Bonding & Die Solder Machines

16395.

Submikron Semiconductor Die Bonding & Die Solder Machines Open Details in New Window [Oct 09, 2023]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd