Jiangsu Profile
Product List
16381. Semiconductor High-Precision Die Bonder Machine Made in China 
[Dec 05, 2023]
[Dec 05, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16382. High Precision Eutectic Machine for Semiconductor Chips [Dec 05, 2023]
[Dec 05, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16383. Semiconductor Fully Automatic Optical Testing Equipment [Nov 28, 2023]
[Nov 28, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16384. Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16385. Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16386. Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16387. Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Nov 22, 2023]
[Nov 22, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16388. Power Semiconductor High-Precision Die Bonding Equipment [Nov 20, 2023]
[Nov 20, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16389. Semiconductor Back-End Packaging and Bonding Placement Equipment [Nov 17, 2023]
[Nov 17, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16390. Bozhon Semiconductor Die Bonding Machine China Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16391. Submikron Semiconductor Die Bonding & Die Solder Machines [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
16392. Factory Customized Aluminum Parts Medical Semiconductor Parts Automation Turning and Milling ... [Dec 11, 2023]
[Dec 11, 2023] Our Advantages UE(user experience) Certifications CNC machining has entered this era of rapid development, many industries can use CNC machining, such as aviation, medical, automobile, motorcycle, ...
16393. Precision Turned-Milling Machining OEM/ODM Small CNC Turning Milling Parts for Swiss ... [Feb 26, 2024]
[Feb 26, 2024] Model NO. Custom Parts Application Fastener, Auto and Motorcycle Accessories, Hardware Tool, Machinery Accessory Standard GB, EN, China GB Code, JIS Code, TEMA, ASME Surface Treatment Anodizing Production ...
16394. Advanced Carbon Fiber Medical Parts for Cutting-Edge Semiconductor Drones [Apr 07, 2025]
[Apr 07, 2025] Our esteemed company proudly boasts a dynamic team of over 100 skilled internal employees, generating an exceptional annual output value of more than 80 million yuan. Equipped with over 60 state-of-the-art main ...
Company: Suzhou Xuan Xin Technology Co., Ltd
16395. Custom Carbon Fiber Medical Parts for Enhanced Semiconductor Drone Functionality [Apr 07, 2025]
[Apr 07, 2025] Our esteemed company boasts an impressive workforce of over 100 dedicated employees, generating an annual output value surpassing 80 million yuan. With an arsenal of more than 60 advanced production machines, our ...
Company: Suzhou Xuan Xin Technology Co., Ltd
