Jiangsu Profile
Product List
8491. Advanced Wafer Tube Cleaning Machine for Efficient Production 
[Dec 13, 2025]
[Dec 13, 2025] Features •Efficient and energy-saving drying system; •Atmospheric mixed ozone washing,ensure mixing effectiveness; •Cold/hot water slow lift process, wider process window, •Combining efficient filtration with ...
8492. Advanced Integrated Solidifying Machine for Multi-Functional Die Bonding [Dec 13, 2025]
[Dec 13, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
8493. High-Precision Semiconductor Chip Placement Machine for Efficient Dispensing [Dec 13, 2025]
[Dec 13, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
8494. Automatic Laser Deflashing Machine with Automatic Loading and Unloading Function [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Laser scanning and vaporization for deflashing. No chemical softening or high-pressure water jetting required Optical shaping technology, ensuring no damage to tube pins.Improving ...
8495. Precision Laser Trimming Machine for Circuit Board Repair Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
8496. High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] Product DescriptionDPS-04 Product advantages High resolution optical lens improves line quality Automatic optical focusing integration technology to overcome the uneven thickness of the board Advanced air float platform ...
8497. High-Precision Laser Drilling Machine with Fast Zoom Functionality [Dec 13, 2025]
[Dec 13, 2025] Product Description Product advantages using the high-speed laser drilling control system of acousto-optic devices real-time detection rapid zoom within 100ns level can change laser spot energy density and ...
8498. Djj-120 Automatic Chamfering Machine for Semiconductor Wafer [Dec 13, 2025]
[Dec 13, 2025] Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering Machine In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining high ...
8499. Advanced High Precision Mh601L Testing Machine for Communication Devices [Dec 13, 2025]
[Dec 13, 2025] Product Description Specification Category Details PCB Size MH601L: 50-60 x 320 x 260 mm MH601: 50-65 x 260 x 200 mm Machine Combined Accuracy ±7.5 microns The Smallest Probe 0.05 mm PCB ...
8500. High-Precision SMT LCD Dispensing Machine for Epoxy Adhesives [Dec 13, 2025]
[Dec 13, 2025] Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...
8501. High Precision CCD Automatic Glue Dispensing Machine for Digital Components [Dec 13, 2025]
[Dec 13, 2025] Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...
8502. Advanced Industrial Seam Welding Machine with High Precision Technology [Dec 13, 2025]
[Dec 13, 2025] Product Description PSS-H160 parallel seam welding machine is a semi-automatic equipment. This device can be used for metal bases and covers Airtight packaging between. This equipment is equipped with a highly ...
8503. Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
8504. High-Precision Automatic Laser Trimming Machine for PCB Applications [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit function trimming . The high-precision laser trimming automation ...
8505. High-Performance Fiber Laser Cutting Machine with Double Drive [Dec 13, 2025]
[Dec 13, 2025] Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive fiber laser cutting equipment. It has the advantages of stable performance, high ...
