Jiangsu Profile
Product List
8506. Precision Cutting and Trenching Machine for Fpcba and PCBA 
[Dec 13, 2025]
[Dec 13, 2025] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
8507. High-Precision Cutting and Drilling Machine for Advanced Ceramics [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
8508. Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...
8509. Advanced Eutectic Wafer Production Machine for Precision Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
8510. High-Speed Precision Dispensing Machine for Accurate Volumetric Measurement [Dec 13, 2025]
[Dec 13, 2025] Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...
8511. High-Speed Precision Glue Dispensing Machine for SMT Applications [Dec 13, 2025]
[Dec 13, 2025] Product Description 1. WINDOWS operating system - Using computer control, fault sound and light alarm and menu display 2. CCD visual positioning system 3. Adopt linear motor + motion control card 4. Modular ...
8512. Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
8513. Advanced High Efficiency Die Bonding Machine for Precise Chip Placement [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
8514. Automatic Translational Sorting Machine Non-Standard Customized for Wafer Laser Processing [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports ...
8515. Qxh-3116 Fully Automatic Lead Wedge Welding and Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production and ...
8516. Advanced Pss-H160 Seam Welding Machine for Optimal Production Efficiency [Dec 13, 2025]
[Dec 13, 2025] Product Description PSS-H160 parallel seam welding machine is a semi-automatic equipment. This device can be used for metal bases and covers Airtight packaging between. This equipment is equipped with a highly reliable ...
8517. Factory Direct Price Sales Qfn Testing and Sorting Machine (Packaging size 3mmx3mmw~50mmx50mm) [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports ...
8518. High-Precision CO2 Laser Engraving Machine for Crafts & Textiles [Dec 13, 2025]
[Dec 13, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
8519. High-Speed Precision Automatic Dispensing Machine for Large-Scale Production [Dec 13, 2025]
[Dec 13, 2025] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
8520. Low-K/CMOS Wafer Laser Grooving Cutting Machine [Dec 13, 2025]
[Dec 13, 2025] Low-K/CMOS Wafer Laser Grooving Cutting Machine Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform. Equipped with special customized laser head, which ...
