Jiangsu Profile
Product List
8386. Fiber Laser Cutting Machine for Various Alloy Materials Pipe 
[Aug 15, 2025]
[Aug 15, 2025] Fiber Laser Cutting Machine for Various Alloy Materials Pipe Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine ...
8387. High Configuration/High-Performance Fiber Laser Cutting Machine [Aug 15, 2025]
[Aug 15, 2025] High Configuration/High-Performance Fiber Laser Cutting Machine Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting ...
8388. No Blind Spots During Processing Efficient Punching Laser Cutting Combined Machine [Sep 04, 2025]
[Sep 04, 2025] Product Features 1. The CNC Punching and Laser Cutting Combined Machine is a masterpiece of innovation, seamlessly blending the complete processing techniques of servo punching machines with the remarkable attributes of ...
8389. Continuous Automated Production Semiconductor Sic Composite Coating Vertical Furnace Integrated ... [Aug 14, 2025]
[Aug 14, 2025] Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...
8390. Integrated Multi-Functional Patch Solidifying Machine/Die Bonder Chip Bonding Machine [Aug 14, 2025]
[Aug 14, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
8391. Made in China Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Aug 14, 2025]
[Aug 14, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
8392. Low-K/CMOS Wafer Laser Grooving Cutting Machine [Aug 14, 2025]
[Aug 14, 2025] Low-K/CMOS Wafer Laser Grooving Cutting Machine Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform. Equipped with special customized laser head, ...
8393. Djj-120 Automatic Chamfering Machine for Semiconductor Wafer [Aug 14, 2025]
[Aug 14, 2025] Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering Machine In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining ...
8394. High Cutting Efficiency Interactive Fiber Laser Cutting Machine with Stable Performance [Aug 13, 2025]
[Aug 13, 2025] Product Description MPS-8025H series is a dual drive gantry interactive optical fiber laser cutting equipment tailored for the sheet metal processing industry. It can cut all kinds of metal materials, with the ...
8395. High-Precision Laser Trimming Automation Machine with Fully Automatic Loading / Unloading Mechanism [Aug 13, 2025]
[Aug 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
8396. Fully Automatic Precision Laser Trimming Machine for Circuit Function Trimming [Aug 13, 2025]
[Aug 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit function trimming . The high-precision laser trimming automation ...
8397. Low Noise Processing Accuracy 0.10mm Maximum Load Weight 156kg Industrial Punching Machine [Sep 04, 2025]
[Sep 04, 2025] Product Features 1. The CNC Punching and Laser Cutting Combined Machine is a masterpiece of innovation, seamlessly blending the complete processing techniques of servo punching machines with the remarkable attributes ...
8398. Precision Drilling/Cutting/Scribing Machine for Alumina/Aluminiumnitride/Zirconium ... [Aug 12, 2025]
[Aug 12, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
8399. Semiconductor Bonding Equipment High Precision Wafer Placement Accuracy Die Bonder Machine [Aug 11, 2025]
[Aug 11, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
8400. High-Precision Die Bonder Integrated Multi-Functional Patch Solidifying Machine [Aug 11, 2025]
[Aug 11, 2025] High-Precision Die Bonder Integrated Multi-Functional Patch Solidifying Machine Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and ...
