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High Speed Dispensing Machine with Precision Weight Measurement Ensures Accurate Volumetric ...
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8371.

High Speed Dispensing Machine with Precision Weight Measurement Ensures Accurate Volumetric ... Open Details in New Window [Aug 18, 2025]

Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance
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8372.

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance Open Details in New Window [Aug 18, 2025]

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Laser Deflashing Machine with Automatic Loading and Unloading Function
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8373.

Automatic Laser Deflashing Machine with Automatic Loading and Unloading Function Open Details in New Window [Aug 18, 2025]

Product Description Product Features Laser scanning and vaporization for deflashing. No chemical softening or high-pressure water jetting required Optical shaping technology, ensuring no damage to tube pins.Improving ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China
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8374.

Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China Open Details in New Window [Aug 18, 2025]

Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System
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8375.

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Open Details in New Window [Aug 18, 2025]

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
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8376.

Laser Decapping Machine with Position Preview Function for Packaging & Testing Line Open Details in New Window [Aug 18, 2025]

Product Description Product Features Position preview function,flexible setting of open cover shape, position and size Laser distance measurement with automatic focus,CCD video coaxial observation of laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
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8377.

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer Open Details in New Window [Aug 18, 2025]

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production
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8378.

Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production Open Details in New Window [Aug 18, 2025]

Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production Product Description Laser Internal modification machine for lt/ln wafer Equipment features: 1. Specially designed laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automated Production Sic / Si Laser Wafer Internal Modification Machine
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8379.

Automated Production Sic / Si Laser Wafer Internal Modification Machine Open Details in New Window [Aug 18, 2025]

Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser system 2. Excellent cutting effect 3. Fully automated production 4. High precision ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Customized High Efficiency Laser Trimming Machine for Circuit Board Industry Line Repair
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8380.

Customized High Efficiency Laser Trimming Machine for Circuit Board Industry Line Repair Open Details in New Window [Aug 18, 2025]

Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Packing Machine for Electric Wire Cable Coiling
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8381.

Automatic Packing Machine for Electric Wire Cable Coiling Open Details in New Window [Aug 19, 2025]

Product Description Automatic Coiling And Strapping Wrapping Machine Cable Coil Bundling Machine Cable Packing Machine For Wire And Cable 1. The wire can be supplied by the pay-off machine or directly connected ...

Company: Alpha Technical Industrial Co., Ltd.

High Performance Automatic Coiling and Strapping Wrapping Machine Cable Coil Bundling Machine
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8382.

High Performance Automatic Coiling and Strapping Wrapping Machine Cable Coil Bundling Machine Open Details in New Window [Aug 19, 2025]

High Performance Automatic Coiling And Strapping Wrapping Machine Cable Coil Bundling Machine Product Description 1. The wire can be supplied by the pay-off machine or directly connected to the extruder. The ...

Company: Alpha Technical Industrial Co., Ltd.

Automatic Laser Power Drum Cutting Machine for Traditional Sheet Metal Processing
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8383.

Automatic Laser Power Drum Cutting Machine for Traditional Sheet Metal Processing Open Details in New Window [Aug 15, 2025]

Automatic Laser Power Drum Cutting Machine for Traditional Sheet Metal Processing Product Description MPS-1500SL series laser processing flexible production line is the latest "fully automatic sheet metal laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Vp-10L Inline Vacuum Plasma Treatment System Machine with Inline Conveying System
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8384.

Vp-10L Inline Vacuum Plasma Treatment System Machine with Inline Conveying System Open Details in New Window [Aug 15, 2025]

Product Description Product features: 1. Adjustable - use electric amplitude modulation for the conveying mechanism, and the width can be adjusted arbitrarily; 2. Inline conveying system - used for communicating ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Sheet Metal Laser Cutting Machine with Laser Flexible Production Line
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8385.

Fully Automatic Sheet Metal Laser Cutting Machine with Laser Flexible Production Line Open Details in New Window [Aug 15, 2025]

Fully Automatic Sheet Metal Laser Cutting Machine With laser flexible production line Product Description MPS-1500SL series laser processing flexible production line is the latest "fully automatic sheet metal laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.