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Factory High Efficiency ISO Approved High Speed PCB Module Laser Cutting Machine
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8341.

Factory High Efficiency ISO Approved High Speed PCB Module Laser Cutting Machine Open Details in New Window [Aug 20, 2025]

Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser
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8342.

Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser Open Details in New Window [Aug 20, 2025]

Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process results Automatic adjustment of grooving width Auto-focus, image memorization and identification, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fiber Laser Cutting Machine Combined with Excellent Heat Treatment and Machining Processes
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8343.

Fiber Laser Cutting Machine Combined with Excellent Heat Treatment and Machining Processes Open Details in New Window [Aug 20, 2025]

Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Performance Energy Bar Cutting Machine for Efficient Production
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8344.

High-Performance Energy Bar Cutting Machine for Efficient Production Open Details in New Window [Aug 19, 2025]

Product Description Introducing our state-of-the-art Robust Energy Bar Machine, meticulously designed for the seamless formation of mixed grains, red fruit sticks, fruit bars, and nutritious sticks. This machine is ...

Company: Dongtai Chaoyang Food Machinery Co., Ltd.

Mps-6025h Interactive Optical Fiber Laser Cutting Machine for Metal Material Processing Industry
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8345.

Mps-6025h Interactive Optical Fiber Laser Cutting Machine for Metal Material Processing Industry Open Details in New Window [Aug 21, 2025]

Product Description The MPS-H series of products is the preferred model in the metal material processing industry, with strong cutting ability, flying cutting speed, extremely low operating costs, excellent ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality Cable Wire Wrapping & Coiling Machine
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8346.

High Quality Cable Wire Wrapping & Coiling Machine Open Details in New Window [Aug 21, 2025]

Product Description Automatic Coiling And Strapping Wrapping Machine Cable Coil Bundling Machine Cable Packing Machine For Wire And Cable 1. The wire can be supplied by the pay-off machine or directly connected ...

Company: Alpha Technical Industrial Co., Ltd.

Fully Automatic Coiling and Packing Machine, Wire Cable Wrapping Machine
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8347.

Fully Automatic Coiling and Packing Machine, Wire Cable Wrapping Machine Open Details in New Window [Aug 21, 2025]

Fully Automatic Coiling and Packing Machine,Wire Cable Wrapping Machine Product Description Automatic Coiling And Strapping Wrapping Machine Cable Coil Bundling Machine Cable Packing Machine For Wire And Cable 1. ...

Company: Alpha Technical Industrial Co., Ltd.

High Speed Dispensing Machine with Precision Weight Measurement Ensures Accurate Volumetric ...
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8348.

High Speed Dispensing Machine with Precision Weight Measurement Ensures Accurate Volumetric ... Open Details in New Window [Aug 18, 2025]

Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance
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8349.

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance Open Details in New Window [Aug 18, 2025]

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Laser Deflashing Machine with Automatic Loading and Unloading Function
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8350.

Automatic Laser Deflashing Machine with Automatic Loading and Unloading Function Open Details in New Window [Aug 18, 2025]

Product Description Product Features Laser scanning and vaporization for deflashing. No chemical softening or high-pressure water jetting required Optical shaping technology, ensuring no damage to tube pins.Improving ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China
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8351.

Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China Open Details in New Window [Aug 18, 2025]

Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System
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8352.

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Open Details in New Window [Aug 18, 2025]

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
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8353.

Laser Decapping Machine with Position Preview Function for Packaging & Testing Line Open Details in New Window [Aug 18, 2025]

Product Description Product Features Position preview function,flexible setting of open cover shape, position and size Laser distance measurement with automatic focus,CCD video coaxial observation of laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer
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8354.

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer Open Details in New Window [Aug 18, 2025]

Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production
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8355.

Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production Open Details in New Window [Aug 18, 2025]

Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production Product Description Laser Internal modification machine for lt/ln wafer Equipment features: 1. Specially designed laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.