Jiangsu Profile
Famous Export Brand
Product List
11011. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine 
[Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
11012. Advanced Fully Automatic Die Bonding Machine for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
11013. Advanced Automated Back Grinding Machine for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
11014. Advanced High Efficiency Hmds Pretreatment System for Adhesives [Feb 28, 2026]
[Feb 28, 2026] Product Description Advantages of HMDS pretreatment system: 1. The pretreatment performance is better. Since the HMDS treatment is carried out after several nitrogen replacements, there will be no interference ...
11015. Advanced Smart Laser Debonding System with Real-Time Monitoring [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
11016. Advanced Fully Automatic Semiconductor Molding System with Quick Mold Change [Feb 28, 2026]
[Feb 28, 2026] Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 inch touch screen+touch ...
11017. Advanced High Precision Die Bonder for Semiconductor Packaging [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
11018. Advanced Automated Wafer Film Application and Cleaning Solution for Precision Manufacturing [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal damage Real-time monitoring and automatic compensation, ...
11019. Advanced Precision Wafer Die Bonder with Smart Control Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
11020. Advanced Precision Eutectic Die Bonding Equipment for High-Quality Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for different kinds ...
11021. High-Temperature 600 °C Hot Air Circulation Furnace for Ceramics [Feb 28, 2026]
[Feb 28, 2026] Product Description Hot air circulation rubber discharge furnace (degreasing furnace) The hot air circulation dispensing furnace is specifically designed for the dispensing process of ceramics using various molding ...
11022. Advanced Integrated Furnace for High-Quality Aluminum Nitride Substrates [Feb 28, 2026]
[Feb 28, 2026] Product Description Mainly used for precision dispensing of aluminum nitride ceramic substrates, silicon nitride ceramic substrates, dielectric ceramics, SOFC solid fuel cell cells, nitrogen oxygen sensors, and other ...
11023. Advanced Automatic High Precision Die Bonder for Qfp/Lqfp/Qfn [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
11024. Premium Quality Neutral Silicone Sealant for All Weather Conditions [Mar 03, 2026]
[Mar 03, 2026] RUNTAI NEUTRAL SILICONE SEALANT Overview RT-193 is a ready to use, one component, neutral silicone sealant for industrial and glazing applications. It cures at room temperature by the action with atmosphere moisture to ...
11025. Factory Gourd Bubble Film Double-Row Express Packaging Inflatable Fruit Filler Shock-Proof ... [Jan 12, 2026]
[Jan 12, 2026] To make cushioning simple and safe! Product Parameters Product Name Air Inflatable Bag,Protective Packaging,Inflatable Cushioning Wrap,Air Bubble Film Product ...
