Jiangsu Profile
Famous Export Brand
Featured Products
Product List
7426. Picosecond Flawless-Edge Laser Cutting & Splitting Machine for Brittle Ceramic 
[Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7427. Picosecond Micro-Crack-Free Laser Cutting & Splitting Machine for Ceramic [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7428. Picosecond Smooth-Finish Laser Cutting & Splitting Machine for Ceramic [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7429. Picosecond High-Finesse Laser Cutting & Splitting Machine for Ceramic Substrate [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7430. Picosecond Clean-Cut Laser Cutting & Splitting Machine for Hard Ceramics [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7431. Desktop Automatic Glue Dispensing Machine Semiconductor Dispenser Device with Visual Function [Sep 28, 2026]
[Sep 28, 2026] Desktop Automatic Glue Dispensing Machine semiconductor Dispenser device with Visual Function Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS ...
7432. Picosecond Stable Laser Cutting & Splitting Machine for Consistent Ceramic Machining [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7433. Picosecond Cold Processing Laser Cutting & Splitting Machine for Smooth Ceramic [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7434. High-Precision Automatic Die Bonding Machine for Semiconductor Applications [Sep 28, 2026]
[Sep 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
7435. Picosecond Cold Process Laser Cutting & Splitting Machine for Delicate Ceramic Components [Sep 28, 2026]
[Sep 28, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7436. High-Performance Laser Cutting Machines for Precision Grooving Solutions [Sep 28, 2026]
[Sep 28, 2026] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
7437. Advanced GaN Wafer Laser Dicing System for Semiconductor Manufacturing [Sep 28, 2026]
[Sep 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
7438. Advanced Precision Glue Dispensing Machine with LED Illumination [Sep 28, 2026]
[Sep 28, 2026] Desktop LED Automatic Glue Dispensing Machine Control Software Windows System device factory Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
7439. Advanced Plasma Cleaning Solutions for Semiconductor Manufacturing Excellence [Sep 28, 2026]
[Sep 28, 2026] Product Description 1. Stainless steel of the vacuum chamber; 2. Ultra low temperature - The temperature is as low as 40 ºC; 3. Omnidirectional surface cleaning - Different plasma can enter the ultra-fine ...
7440. High-Precision Mopa Fiber Laser Engraver for Metal Artwork [Sep 28, 2026]
[Sep 28, 2026] Product Description Introducing our state-of-the-art Portable MOPA Fiber Laser Marking Machine, meticulously crafted for flawless precision in marking both metallic and selected non-metallic surfaces. This powerhouse ...
