Jiangsu Profile
Famous Export Brand
Product List
7411. Si3n4 Ceramic Slitter Cutting Plate Industrial Silicon Nitride Cutter Blade 
[Sep 29, 2026]
[Sep 29, 2026] Product Description Customized Si3N4 Long Cutting Blade Our gas pressure sintered silicon nitride ceramic cutting blades are made of high purity silicon nitride raw material. After gas pressure sintering, the blanks are ...
7412. Picosecond Nonthermal Laser Cutting & Splitting Machine for Tidy Edge Ceramic Machining [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7413. Picosecond High-Quality Laser Cutting & Splitting Machine for Tidy Durable Ceramic Parts [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7414. Picosecond Tight-Tolerance Laser Cutting & Splitting Machine for Seamless Ceramic Pieces [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7415. Picosecond Ultra-Sharp Laser Cutting & Splitting Machine for Ceramic Fringe Removal [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7416. Picosecond Low Heat Damage Laser Cutting & Splitting Machine for Ceramic Machining [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7417. Picosecond Low-Deformation Laser Cutting & Splitting Machine for Ceramic Machining [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7418. Picosecond Stress-Free Laser Cutting & Splitting Machine for Ceramic Processing [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7419. Porcelain Cutting Disc Dry Wet Diamond Saw Blade for Cutting Tile Ceramic [Sep 29, 2026]
[Sep 29, 2026] Product Description Diamond Saw Blade segmented blade laser welded blade hot/cold pressed sintered continuous blade hot pressed sintered blade turbo blade hot pressed sintered blade turbo wave blade turbo deep teeth ...
Company: Jiangsu Yaofeng Tools Co., Ltd.
7420. Picosecond Zero Microcrack Laser Cutting & Splitting Machine for Ceramic Dicing [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7421. Picosecond Superb Edge Laser Cutting & Splitting Machine for Vertical Ceramic Cutting Face [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7422. Picosecond High-Precision Laser Cutting & Splitting Machine for Vertical Neat Ceramic Cuts [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7423. Picosecond Crack-Free Laser Cutting & Splitting Machine for Ceramic Dicing [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7424. Picosecond Low-Stress Laser Cutting & Splitting Machine for Fragile Ceramic Structures [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
7425. Picosecond Accurate-Contour Laser Cutting & Splitting Machine for Fine Ceramic Components [Sep 29, 2026]
[Sep 29, 2026] Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...
