Jiangsu Profile
Product List
18886. Laser Cutting Equipment with Imported Servo Drives, Customized Systems, and Other Configurations 
[Jul 22, 2025]
[Jul 22, 2025] Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D ...
18887. Ceramic Laser Drilling/Dicing Machine with Multi-Feature CCD Visual Positioning [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, cutting ...
18888. Substrate Display Glass C500 Semiconductor Equipment Is Mainly Used in Display Industry [Jul 22, 2025]
[Jul 22, 2025] Product Description Tool Spec Machine Type Cluster ALD Substrate Display Glass Temperature 150-250ºC Depo Rate 0.33nm/min Plasma Source CCP Injection Type Shower head Leak Rate <2mTorr/min Films IGZO Exhibition & ...
18889. CCD Visual Spray Dispenser SMT Glue Dispensing Machine LED Package Industrial Equipment [Jul 22, 2025]
[Jul 22, 2025] CCD Visual Spray Dispenser SMT Glue Dispensing Machine LED Package industrial equipment Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and ...
18890. Wafer Circuit Boards UV Laser Marking Machine with CE Mark and Semi Standard [Jul 22, 2025]
[Jul 22, 2025] Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser ...
18891. Small Semiconductor Die Bonding System Wafer Die Attach Eutectic Bonder [Jul 22, 2025]
[Jul 22, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is ...
18892. Automatic Desktop Dispensing Robot Vision Glue Dispensing Machine CCD Visual Positioning Equipment [Jul 22, 2025]
[Jul 22, 2025] Automatic Desktop Dispensing Robot Vision Glue Dispensing Machine CCD Visual Positioning equipment Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
18893. China Wholesale Ultra-Shallow Dopant Laser Annealing Machine for Bsi-CCD Wafer [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
18894. Industrial Dispensing Machine Desktop Robot Glue Coating Dispenser Device Producer [Jul 22, 2025]
[Jul 22, 2025] Industrial Dispensing machine Desktop Robot Glue coating Dispenser device producer Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
18895. Air Cooling Fully Automatic PCBA & IC & Wafer Laser Marking Machine [Jul 22, 2025]
[Jul 22, 2025] Air Cooling Fully Automatic PCBA & IC & Wafer Laser Marking Machine Product Description Brief Description Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC and so ...
18896. CO2 Metal RF Laser Full Automatic Laser Marking Machine [Jul 22, 2025]
[Jul 22, 2025] Product Description It can be widely used in graphic marks on craft gifts, clothing leather, wood paper, food packaging, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and other ...
18897. Automatic Loading and Unloading Wafer Bonder Machine with Remote Online Diagnostics [Jul 22, 2025]
[Jul 22, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is ...
18898. PCBA Laser Marking Machine for Large-Size PCBA Boards and Packaging Substrates [Jul 22, 2025]
[Jul 22, 2025] PCBA Laser Marking Machine for Large-Size PCBA Boards and Packaging Substrates Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet ...
18899. Ceramic Laser Drilling/Automatic Dicing Saw Machine with CCD Visual Positioning [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
18900. Laser Precision Cutting Machine with Multi-Feature CCD Visual Positioning [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / half ...
