Jiangsu Profile
Product List
18856. High Quality Automatic PCB Board Staggered Cutting Machine with Double Stations 
[Jul 22, 2025]
[Jul 22, 2025] High Quality Automatic PCB Board Staggered Cutting Machine with Double Stations Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good ...
18857. High Quality 12inch Fully Automatic Soft Solder Die Bonding Machine [Jul 22, 2025]
[Jul 22, 2025] High Quality 12inch Fully automatic soft solder die bonding machine Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
18858. High Quality Vacuum Eutectic Welding Furnace Vsr-20MPa [Jul 22, 2025]
[Jul 22, 2025] Product Description Vacuum eutectic welding furnace VSR-20MPA The advanced process system assisted by microwave plasma is mainly used for high reliability cavity free brazing of high-power chips and substrate ...
18859. High Quality ISO Approved Automatic Equipment for Circuit Board Laser Cutting Machine [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / half ...
18860. Wafer Bonding System Machine Automated Bond Process Execution and Data Logging [Jul 22, 2025]
[Jul 22, 2025] Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The ...
18861. PCB X-out Laser Marking Equipment for Semiconductor Packaging Boards and Electronic Module Boards [Jul 22, 2025]
[Jul 22, 2025] PCB X-out Laser Marking Equipment for Semiconductor packaging Boards and Electronic module Boards Product Description Product Features Automatic recognition of front-end process marks. Direct access to Mapping files ...
18862. Automatic Laser Cutting Machine for Circuit Boards, Packaging IC Carrierboard Precision Cutting [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / half ...
18863. Fully-Automatic Loading and Unloading PCBA & IC & Wafer Marking Machine [Jul 22, 2025]
[Jul 22, 2025] Fully-Automatic Loading and Unloading PCBA & IC & Wafer Marking Machine Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading ...
18864. Bsi-CCD Wafer Dopant Laser Annealing Equipment with Precise Energy Density Control [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
18865. Automatic Substrate Laser Marking Machine with High-Precision Digital Scanning Oscillator [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning oscillator & Mechanical + CCD positioning to ensure marking accuracy Robotic ...
18866. High Cutting Efficiency Interactive Fiber Laser Cutting Machine with Stable Performance [Jul 22, 2025]
[Jul 22, 2025] Product Description MPS-8025H series is a dual drive gantry interactive optical fiber laser cutting equipment tailored for the sheet metal processing industry. It can cut all kinds of metal materials, with the ...
18867. Ceramic Laser Drilling/Dicing Equipment for Precision Drilling, Cutting Andscribing of ... [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, cutting ...
18868. Laser Cutting Equipment with Imported Servo Drives, Customized Systems, and Other Configurations [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D ...
18869. Ceramic Laser Drilling/Dicing Machine with Multi-Feature CCD Visual Positioning [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, cutting ...
18870. Substrate Display Glass C500 Semiconductor Equipment Is Mainly Used in Display Industry [Jul 22, 2025]
[Jul 22, 2025] Product Description Tool Spec Machine Type Cluster ALD Substrate Display Glass Temperature 150-250ºC Depo Rate 0.33nm/min Plasma Source CCP Injection Type Shower head Leak ...
