Jiangsu Profile
Product List
18841. 12inch Fully Automatic Soft Solder Die Bonding Machine Factory 
[Jul 22, 2025]
[Jul 22, 2025] 12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new architecture ...
18842. High Quality ISO Approved High Speed PCB Module Laser Cutting Machine [Jul 22, 2025]
[Jul 22, 2025] High Quality ISO Approved High Speed PCB Module Laser Cutting Machine Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality ...
18843. Double-Tube Fully Automatic Vertical Furnace for Pi Cuer, Annealing, Alloy [Jul 22, 2025]
[Jul 22, 2025] Double-Tube Fully Automatic Vertical Furnace for PI Cuer, annealing, alloy Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, ...
18844. Dqx Series Radio Frequency Plasma Cleaning Machine [Jul 22, 2025]
[Jul 22, 2025] Dqx Series Radio Frequency Plasma Cleaning Machine Product Description The principle of plasma cleaning is to from high frequency alternating electrodes in vacuum condition, so that the gas in this area will from ...
18845. High Quality CO2 Laser Marking Engraving Machine [Jul 22, 2025]
[Jul 22, 2025] High quality CO2 Laser Marking Engraving Machine Product Description Characters Advanced processing model, high efficiency, low cost; Full automation, easy to operate; Environmental friendly; Easy to identify ...
18846. Automatic CCD Visual Glue Dispenser Machine Semiautomatic Three-Axis Desktop Dispensing Equipment ... [Jul 22, 2025]
[Jul 22, 2025] Industrial Dispensing machine Desktop Robot Glue coating Dispenser device producer Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
18847. Sic UV Laser Annealing Machine for Bsi-CCD Wafer Precise Energy Density Control [Jul 22, 2025]
[Jul 22, 2025] Sic UV Laser Annealing Machine for Bsi-CCD Wafer Precise Energy Density Control Product Description Product Features First domestic green laser machine for mass pruduction High reliability and ...
18848. High Quality Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Jul 22, 2025]
[Jul 22, 2025] High Quality Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level ...
18849. High Quality Hard-Brittle Material Substrates Cutting Equipment [Jul 22, 2025]
[Jul 22, 2025] High Quality Hard-Brittle Material Substrates Cutting Equipment Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical ...
18850. High-Quality Fiber Laser Cutting Equipment with High Reliability and User-Friendly Operation [Jul 22, 2025]
[Jul 22, 2025] High-Quality Fiber Laser Cutting Equipment with High Reliability and User-Friendly Operation Product Description MPS-0806D is a small-format fiber laser cutting machine with international standards specially ...
18851. High-Precision Die Attach Packaging Machine Chip Mounter Equipped with Die Attach System [Jul 22, 2025]
[Jul 22, 2025] High-Precision Die Attach Packaging Machine Chip Mounter Equipped with Die Attach System Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ...
18852. High Quality Sic UV Laser Annealing Machine for Bsi-CCD Wafer [Jul 22, 2025]
[Jul 22, 2025] High Quality Sic UV Laser Annealing Machine for Bsi-CCD Wafer Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped ...
18853. High Quality Fmj Series High-Temperature Box Sintering Furnace [Jul 22, 2025]
[Jul 22, 2025] High Quality Fmj Series High-Temperature Box Sintering Furnace Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation ...
18854. High Quality Fully Automatic Soft Solder Die Bonding Machine Factory [Jul 22, 2025]
[Jul 22, 2025] High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
18855. High Quality Industrial Dispensing Automation Robot Used for Semiconductor Packaging/SMT Assembly [Jul 22, 2025]
[Jul 22, 2025] High Quality Industrial Dispensing Automation Robot Used for Semiconductor Packaging/SMT Assembly Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS ...
