Jiangsu Profile
Product List
79756. High Precision Laser Marking System for Electronics and PCB Production 
[Nov 03, 2026]
[Nov 03, 2026] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer ...
79757. Advanced Vertical Wafer Drying System for Semiconductor Manufacturing Equipment [Nov 03, 2026]
[Nov 03, 2026] Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...
79758. High-Performance Automated Die Bonding Equipment for Precision Assembly Applications [Oct 29, 2026]
[Oct 29, 2026] Fully automatic Clip Bonder machine manufacturer die bonding equipment The fully automatic Clip Bonder equipment is developed, designed, produced and sold by Himalaya Semiconductor Technology Co., Ltd. The equipment is ...
79759. Precision Wafer Grinding Systems for Superior Production Output and Manufacturing Efficiency [Oct 29, 2026]
[Oct 29, 2026] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse thinning grinding ...
79760. High Precision Industrial Vacuum Furnace for Welding and Brazing Applications [Oct 23, 2026]
[Oct 23, 2026] High Reliability Cavity Free Brazing of High-Power Chips and Substrate Vacuum Eutectic Welding Furnace Product Description Vacuum eutectic welding furnace VSR-20MPA The advanced process system assisted by ...
79761. Semiconductor Sic Sio2 Wafer Stealth Dicing Cutting Equipment System [Oct 23, 2026]
[Oct 23, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide ...
79762. Automatic Die Attachment System for Precision Bonding Solutions [Oct 23, 2026]
[Oct 23, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
79763. Advanced Plasma Cleaner for Efficient Wafer Photoresist Removal Equipment [Oct 29, 2026]
[Oct 29, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
79764. Electrostatic Spraying High Gloss Outdoor Polyester Powder Coating [Oct 28, 2026]
[Oct 28, 2026] Polyester Resin Powder Coating Polyester resin powder coating is the most used of all powder coatings in the worldwide market. Polyester's offer a broad application field and many different chemistries including: ...
79765. Versatile Gantry Wire Bonder Machine for Precision Assembly Applications [Oct 19, 2026]
[Oct 19, 2026] Product Description Our high-performance, fully automated wire bonder designed for a wide range of interconnection applications in semiconductor packaging. It is built with a robust long gantry XY system to accommodate ...
79766. Small Batch Production Vision Dispensing System for Compact Operations [Oct 19, 2026]
[Oct 19, 2026] Product Description TSV-200D Desktop Vision Glue Dispensing Machine - Product Description Precision. Efficiency. Intelligence. The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor ...
79767. Premium Silicone Craft Glue Dispenser for DIY Projects and Creative Making [Oct 19, 2026]
[Oct 19, 2026] Automatic Silicone Glue Dispensing Equipment Desktop Dispenser Product Description TSV-200D Desktop Vision Glue Dispensing Machine - Product Description Precision. Efficiency. Intelligence. The TSV-200D Desktop ...
79768. Advanced High-Precision Automated Die Bonder for Multi-Chip Assembly Solutions [Oct 19, 2026]
[Oct 19, 2026] Product Description Our high-precision, multi-chip, automated die bonding system designed for advanced semiconductor and microelectronic assembly. It is engineered for flexibility, handling a wide variety of chip sizes ...
79769. Advanced Precision Laser Marking for Automotive PCBA Parts and Components [Nov 06, 2026]
[Nov 06, 2026] Fast Speed / High Response Large Format PCBA Laser Marking Machine for Automotive Circuits Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. ...
79770. High Precision Laser Dicer for IC Glass and Ceramic Processing [Nov 06, 2026]
[Nov 06, 2026] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
