Jiangsu Profile
Product List
79696. Insulation Optical Pet Plastic Retardant Polyester Film with UL (6023Z) 
[Apr 18, 2025]
[Apr 18, 2025] Pet Plastic Retardant Film With UL(6023Z) Specifications: Pet Plastic Film With UL(6023Z) Property Unit Index Test Method Thickness μm 50 75 100 175 188 250 GB/T 13542.2-2009 Tensile strength ...
79697. Anti Static Polyester Insulation Optical Pet Stretch Film with UL (6023Z) [Apr 18, 2025]
[Apr 18, 2025] Anti Static Polyester Film With UL(6023Z) Specifications: Anti Static Polyester Film With UL(6023Z) Property Unit Index Test Method Thickness μm 50 75 100 175 188 250 GB/T 13542.2-2009 Tensile ...
79698. Precision Laser Marking Solutions for High-Quality PCB Production Systems [Oct 26, 2026]
[Oct 26, 2026] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Automated PCB Laser Marking System Precision Marking for Electronics Manufacturing Our PCB Laser Marking Systems ...
79699. High Precision Wafer Processing Tool with 15W UV Laser Dicing [Oct 26, 2026]
[Oct 26, 2026] Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...
79700. Advanced Qr Code Marking System for Semiconductor Wafer Identification [Oct 26, 2026]
[Oct 26, 2026] Product Description DSI-G-WMN6021-A Fully Automatic Wafer ID Marking Equipment The DSI-G-WMN6021-A is a state-of-the-art, fully automatic system designed for high-precision and high-throughput permanent marking on a ...
79701. Advanced Laser Cutting Technology for Semiconductor Manufacturing Excellence Solutions [Oct 26, 2026]
[Oct 26, 2026] Wafer Laser Cutting System Wafer Laser Cutting Equipment Wafer Laser Cutting Machine Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer. ...
79702. Advanced Precision Laser Cutting Systems for FPCB Manufacturing Equipment [Oct 26, 2026]
[Oct 26, 2026] High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, ...
79703. Smart Industrial Robot for Efficient Semiconductor Packaging Solutions Automation [Oct 21, 2026]
[Oct 21, 2026] Product Description TSV-200D Desktop Vision Glue Dispensing Machine - Product Description Precision. Efficiency. Intelligence. The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya ...
79704. High Precision Laser Marking System for Electronics and PCB Production [Nov 03, 2026]
[Nov 03, 2026] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer ...
79705. Advanced Vertical Wafer Drying System for Semiconductor Manufacturing Equipment [Nov 03, 2026]
[Nov 03, 2026] Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...
79706. High-Performance Automated Die Bonding Equipment for Precision Assembly Applications [Oct 29, 2026]
[Oct 29, 2026] Fully automatic Clip Bonder machine manufacturer die bonding equipment The fully automatic Clip Bonder equipment is developed, designed, produced and sold by Himalaya Semiconductor Technology Co., Ltd. The equipment is ...
79707. Precision Wafer Grinding Systems for Superior Production Output and Manufacturing Efficiency [Oct 29, 2026]
[Oct 29, 2026] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse thinning grinding ...
79708. High Precision Industrial Vacuum Furnace for Welding and Brazing Applications [Oct 23, 2026]
[Oct 23, 2026] High Reliability Cavity Free Brazing of High-Power Chips and Substrate Vacuum Eutectic Welding Furnace Product Description Vacuum eutectic welding furnace VSR-20MPA The advanced process system assisted by ...
79709. Semiconductor Sic Sio2 Wafer Stealth Dicing Cutting Equipment System [Oct 23, 2026]
[Oct 23, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide ...
79710. Automatic Die Attachment System for Precision Bonding Solutions [Oct 23, 2026]
[Oct 23, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
