Jiangsu Profile
Product List
63001. Optical Diffuser Film for Industrial Camera LED Lighting Uniform Light Distribution 
[Oct 21, 2026]
[Oct 21, 2026] Product Description Characteristics High wavelength selectivity: Capable of precise response to extremely narrow (<1mm) or specific wavelength ranges. High transmission and deep blocking: Transmission within the ...
63002. LED Light Diffuser Film for Industrial Imaging Applications [Oct 21, 2026]
[Oct 21, 2026] Product Description Characteristics High wavelength selectivity: Capable of precise response to extremely narrow (<1mm) or specific wavelength ranges. High transmission and deep blocking: Transmission within the ...
63003. Advanced Precision Wafer Mounting System for Enhanced Thinning Applications [Oct 26, 2026]
[Oct 26, 2026] Product Description Parameter Dimension L933*W450*H317mm Compatible size 6"~8" Total power 500W Input power supply 100-240V AC 50-60HZ Air pressure 0.5-0.8Mpa Film type Blue film/UV film Plate ...
63004. Advanced Plasma Asher for Fast Effective Wafer Adhesive Removal [Oct 26, 2026]
[Oct 26, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
63005. Advanced CCD Glue Dispensing System for LED Potting Solutions and Production [Oct 21, 2026]
[Oct 21, 2026] High Quality Semiconductor SMT Dispensing and Filling Machine Product Description The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated ...
63006. High Precision Wire Bonder for Efficient Electronic Device Packaging Solutions [Oct 21, 2026]
[Oct 21, 2026] Product Description Our advanced automated wire bonder is engineered for high-speed, high-reliability interconnections in semiconductor packaging. It features a robust long-gantry motion system with a spacious 300mm x ...
63007. 2100X2800X18mm Marble High Glossy Melamine MDF [Oct 31, 2026]
[Oct 31, 2026] , Product description: Specifications of plain MDF /melamine mdf board size 1220*2440mm 1220*2745mm 1220*2800mm 1220*3050mm. 1830*2440mm 1830*2750mm 2100*2800 thickness 2~25mm Core ...
63008. Advanced High-Speed Die Attach Solutions for Precision Chip Assembly Equipment [Nov 03, 2026]
[Nov 03, 2026] High-Precision Die Attach Packaging Machine Chip Mounter Equipped with Die Attach System Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ...
63009. 0.8 to 25mm Chip Epoxy Die Bonder with TCP/IP Factory Price [Oct 19, 2026]
[Oct 19, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
63010. Precision Alignment Tools for Optimal IC Wafer Performance and Processing [Oct 19, 2026]
[Oct 19, 2026] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
63011. Precision Bonding Solutions for Semiconductor Applications from 6 to 10 Inches [Oct 19, 2026]
[Oct 19, 2026] Product Description Product Introduction: The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving ...
63012. Mopa Laser Engraving Machine for Precise Steel Marking Applications [Oct 19, 2026]
[Oct 19, 2026] Product Description Himalaya Femtosecond Laser Marking Machine - The Pinnacle of Cold-Ablation Precision Transcend the Limits of Traditional Laser Marking Introducing the Himalaya Femtosecond Laser Marking ...
63013. Custom 10mm Focal Length Optical Biconvex Lens High Precision Glass Lens [Oct 21, 2026]
[Oct 21, 2026] Product Description Characteristics Diverse lens geometries: Includes spherical lenses (plano-convex, biconvex, meniscus, plano-concave, biconcave) and aspheric lenses to meet various optical path correction ...
63014. Pre-Glued Edge Banding Edge Banding with Hot Melt Adhesive Backing [Oct 27, 2026]
[Oct 27, 2026] Specification Product Name Edge Banding Materials PVC/ABS Color Solid Color/ Wood Grain/High Glossy/ Customization ODM/OEM ODM/OEM Usage Furniture Protection MOQ 3000 Me ters Logo Customized Logo Acceptable Width ...
63015. Precision Wafer Mounting Equipment System for Accurate Alignment [Oct 15, 2026]
[Oct 15, 2026] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure uniform ...
