Jiangsu Profile
Product List
62956. Optical Filters Ircut Filter (IR-Cut) for CCD/CMOS Image Sensors 
[Oct 21, 2026]
[Oct 21, 2026] Product Description IRcut Filter (IR-Cut): The IR-Cut Filter is an essential optical component engineered to optimize image quality in visual imaging systems. CMOS and CCD sensors are naturally susceptible to ...
62957. Custom Biconvex Optical Lens N-Bk7 K9 Glass Lens for Imaging Systems [Oct 21, 2026]
[Oct 21, 2026] Product Description Characteristics Diverse lens geometries: Includes spherical lenses (plano-convex, biconvex, meniscus, plano-concave, biconcave) and aspheric lenses to meet various optical path correction ...
62958. Custom Optical Biconvex Lens High Precision Glass Lens for Machine Vision Systems [Oct 21, 2026]
[Oct 21, 2026] Product Description Characteristics Diverse lens geometries: Includes spherical lenses (plano-convex, biconvex, meniscus, plano-concave, biconcave) and aspheric lenses to meet various optical path correction ...
62959. Custom Glass Plano Concave Lens for Advanced Laser Systems [Oct 21, 2026]
[Oct 21, 2026] Product Description Characteristics Diverse lens geometries: Includes spherical lenses (plano-convex, biconvex, meniscus, plano-concave, biconcave) and aspheric lenses to meet various optical path correction ...
62960. Custom Precision Meniscus Lens Optical Lens for Imaging and Optical Systems [Oct 21, 2026]
[Oct 21, 2026] Product Description Characteristics Diverse lens geometries: Includes spherical lenses (plano-convex, biconvex, meniscus, plano-concave, biconcave) and aspheric lenses to meet various optical path correction ...
62961. Optical Diffuser Film for Industrial Camera LED Lighting Uniform Light Distribution [Oct 21, 2026]
[Oct 21, 2026] Product Description Characteristics High wavelength selectivity: Capable of precise response to extremely narrow (<1mm) or specific wavelength ranges. High transmission and deep blocking: Transmission within the ...
62962. LED Light Diffuser Film for Industrial Imaging Applications [Oct 21, 2026]
[Oct 21, 2026] Product Description Characteristics High wavelength selectivity: Capable of precise response to extremely narrow (<1mm) or specific wavelength ranges. High transmission and deep blocking: Transmission within the ...
62963. Advanced Precision Wafer Mounting System for Enhanced Thinning Applications [Oct 26, 2026]
[Oct 26, 2026] Product Description Parameter Dimension L933*W450*H317mm Compatible size 6"~8" Total power 500W Input power supply 100-240V AC 50-60HZ Air pressure 0.5-0.8Mpa Film type Blue film/UV film Plate ...
62964. Advanced Plasma Asher for Fast Effective Wafer Adhesive Removal [Oct 26, 2026]
[Oct 26, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
62965. Advanced CCD Glue Dispensing System for LED Potting Solutions and Production [Oct 21, 2026]
[Oct 21, 2026] High Quality Semiconductor SMT Dispensing and Filling Machine Product Description The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated ...
62966. High Precision Wire Bonder for Efficient Electronic Device Packaging Solutions [Oct 21, 2026]
[Oct 21, 2026] Product Description Our advanced automated wire bonder is engineered for high-speed, high-reliability interconnections in semiconductor packaging. It features a robust long-gantry motion system with a spacious 300mm x ...
62967. 2100X2800X18mm Marble High Glossy Melamine MDF [Oct 31, 2026]
[Oct 31, 2026] , Product description: Specifications of plain MDF /melamine mdf board size 1220*2440mm 1220*2745mm 1220*2800mm 1220*3050mm. 1830*2440mm 1830*2750mm 2100*2800 thickness 2~25mm Core ...
62968. Advanced High-Speed Die Attach Solutions for Precision Chip Assembly Equipment [Nov 03, 2026]
[Nov 03, 2026] High-Precision Die Attach Packaging Machine Chip Mounter Equipped with Die Attach System Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ...
62969. 0.8 to 25mm Chip Epoxy Die Bonder with TCP/IP Factory Price [Oct 19, 2026]
[Oct 19, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
62970. Precision Alignment Tools for Optimal IC Wafer Performance and Processing [Oct 19, 2026]
[Oct 19, 2026] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
