Jiangsu Profile
Product List
21976. Corundum-Mullite Saggar for Silicon Carbide Substrate, 2100 °C, Ar Flow 
[Dec 11, 2025]
[Dec 11, 2025] Corundum-Mullite Saggar - Extreme-Temperature Kiln Furniture for Next-Generation Battery & Ceramic Processing Product Overview Manufactured from 75 % high-purity tabular alumina and 25 % needle-like mullite ...
Company: Suzhou Moat City Technology Ltd
21977. Alumina Plate with Diamond Polished Face for Thin-Film Xrd Substrate [Dec 11, 2025]
[Dec 11, 2025] Alumina Ceramic Refractory Plate - 99% AlO, 1800 °C Ultra-High Temperature Service Our alumina ceramic plates are isostatically pressed from 99% pure α-AlO powder and fired at 1 700 °C in a gas-fired ...
Company: Suzhou Moat City Technology Ltd
21978. High Quality Honeycomb Ceramic Substrate SCR Catalyst for Nox Reduction [Oct 24, 2022]
[Oct 24, 2022] Catalyst feathers Selective catalytic reduction (SCR) catalyst called SCR flue gas denitration catalyst, SCR technology is denitration catalyst in the appropriate temperature, using NH3 as the reducing agent, take the ...
21979. Corundum-Mullite Plate for Thin-Film Xrd Substrate, Surface Roughness <5 Nm [Dec 11, 2025]
[Dec 11, 2025] Corundum-Mullite Saggar - Extreme-Temperature Kiln Furniture for Next-Generation Battery & Ceramic Processing Product Overview Manufactured from 75 % high-purity tabular alumina and 25 % needle-like mullite ...
Company: Suzhou Moat City Technology Ltd
21980. Recrystallized Sic Setter for Electronic Substrates [Sep 13, 2025]
[Sep 13, 2025] Recrystallized Silicon Carbide (RSiC) Sintering Plates: The Pinnacle of High-Temperature Performance Product Overview Our Recrystallized Silicon Carbide (RSiC) Sintering Plates represent the gold standard in ...
Company: Suzhou Moat City Technology Ltd
21981. Independently Developed Solidification Machine Can Achieve Multiple Substrate Transportation Methods [Dec 25, 2023]
[Dec 25, 2023] Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21982. Die Bonding, Process for Placing a Chip on a Package Substrate [Nov 09, 2023]
[Nov 09, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21983. Die Bonding Machine, with The Process for Molding a Chip on Substrate [Oct 18, 2023]
[Oct 18, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21984. Customized Coating Fused Silica Optical Mirror Substrate D-shaped Optical Mirror [Jul 22, 2026]
[Jul 22, 2026]
Company: Band Optics Technology
21985. High Precision Uncoated Fused Silica Optical Mirror Substrate Optical D-shaped Mirror [Jul 22, 2026]
[Jul 22, 2026]
Company: Band Optics Technology
21986. Custom Optical Silicon Crystalline Photonic Wafer Substrate Optical Window [Jul 22, 2026]
[Jul 22, 2026]
Company: Band Optics Technology
21987. Custom Borosilicate Float Glass Optical Window Substrate Optical Wafer [Jul 22, 2026]
[Jul 22, 2026]
Company: Band Optics Technology
21988. Custom Uncoated BK7 Glass Optical D-shaped Mirror Substrate Optical D-shaped Mirror [Jul 22, 2026]
[Jul 22, 2026]
Company: Band Optics Technology
21989. Custom Coating Fused Silica Optical D-shaped Mirror Substrate Optical Mirror [Jul 22, 2026]
[Jul 22, 2026]
Company: Band Optics Technology
21990. Customized High-index Optical Glass Window Substrate Optical Wafer [Jul 22, 2026]
[Jul 22, 2026]
Company: Band Optics Technology
