Jiangsu Profile
Product List
21961. 180W Aluminum Nitride Disk Aln Ceramic Substrate Disc for Communication Components 
[Jan 09, 2023]
[Jan 09, 2023] Product Description Aluminum nitride ceramic (AlN) has excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxic, and thermal expansion ...
21962. Suzhou Beecore Air Filter Metal Honeycomb Substrate Aluminum Honeycomb Filter [Dec 19, 2017]
[Dec 19, 2017] SUZHOU BEECORE air filter metal honeycomb substrate aluminum honeycomb filter: Description: The Activated Carbon Filter is our newly developed to efficiently filter to remove obsorb harmful odor and micro duty ...
21963. Corrosion-Resistant Metallic Catalyst with Porous Substrate for Marine Applications [May 19, 2025]
[May 19, 2025] Product Description Metallic Catalyst High-flow metal catalysts are specialized materials vital for chemical reactions, featuring: Composition: Made of metal - based active components, often precious metals on high - ...
Company: Shandong Keyuan Vehicle Catalytic Converter Manufacturing Co., Ltd.
21964. Good Flow-Ability Metallic Substrate Car Catalyst for Automotive Exhaust Treatment [May 16, 2025]
[May 16, 2025] Product Description Metallic Catalyst High-flow metal catalysts are specialized materials vital for chemical reactions, featuring: Composition: Made of metal - based active components, often precious metals on high - ...
Company: Shandong Keyuan Vehicle Catalytic Converter Manufacturing Co., Ltd.
21965. Direct Sales Credit Card Size Whetstone Steel Plate Substrate Small Woodworking Tools [Feb 24, 2022]
[Feb 24, 2022]
Company: CHANGZHOU HUAYIDA TOOLS CO., LTD.
21966. A Grade Single Side Electrical Substrate Material 1.6mm Fr4/Xpc Ccl for PCB [Aug 21, 2024]
[Aug 21, 2024] Product description FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with ...
21967. Ce and UL Certificated WPC PVC Foam Board Flooring Substrate Conical Double Screw Extrusion ... [Aug 14, 2023]
[Aug 14, 2023] CE and UL Certificated WPC PVC Foam Board Flooring Substrate Conical Double Screw Extrusion Production Line I.Main Designing Parameter of production line 1.1 Power condition:380V/ 3phase/50HZ (or ...
21968. Corundum-Mullite Saggar for Silicon Carbide Substrate, 2100 °C, Ar Flow [Dec 11, 2025]
[Dec 11, 2025] Corundum-Mullite Saggar - Extreme-Temperature Kiln Furniture for Next-Generation Battery & Ceramic Processing Product Overview Manufactured from 75 % high-purity tabular alumina and 25 % needle-like mullite ...
Company: Suzhou Moat City Technology Ltd
21969. Alumina Plate with Diamond Polished Face for Thin-Film Xrd Substrate [Dec 11, 2025]
[Dec 11, 2025] Alumina Ceramic Refractory Plate - 99% AlO, 1800 °C Ultra-High Temperature Service Our alumina ceramic plates are isostatically pressed from 99% pure α-AlO powder and fired at 1 700 °C in a gas-fired ...
Company: Suzhou Moat City Technology Ltd
21970. High Quality Honeycomb Ceramic Substrate SCR Catalyst for Nox Reduction [Oct 24, 2022]
[Oct 24, 2022] Catalyst feathers Selective catalytic reduction (SCR) catalyst called SCR flue gas denitration catalyst, SCR technology is denitration catalyst in the appropriate temperature, using NH3 as the reducing agent, take the ...
21971. Corundum-Mullite Plate for Thin-Film Xrd Substrate, Surface Roughness <5 Nm [Dec 11, 2025]
[Dec 11, 2025] Corundum-Mullite Saggar - Extreme-Temperature Kiln Furniture for Next-Generation Battery & Ceramic Processing Product Overview Manufactured from 75 % high-purity tabular alumina and 25 % needle-like mullite ...
Company: Suzhou Moat City Technology Ltd
21972. Recrystallized Sic Setter for Electronic Substrates [Sep 13, 2025]
[Sep 13, 2025] Recrystallized Silicon Carbide (RSiC) Sintering Plates: The Pinnacle of High-Temperature Performance Product Overview Our Recrystallized Silicon Carbide (RSiC) Sintering Plates represent the gold standard in ...
Company: Suzhou Moat City Technology Ltd
21973. Independently Developed Solidification Machine Can Achieve Multiple Substrate Transportation Methods [Dec 25, 2023]
[Dec 25, 2023] Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21974. Die Bonding, Process for Placing a Chip on a Package Substrate [Nov 09, 2023]
[Nov 09, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
21975. Die Bonding Machine, with The Process for Molding a Chip on Substrate [Oct 18, 2023]
[Oct 18, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
