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Black Custom High-Power Semiconductor / Power Electronics Fin Aluminum Heat Sink
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13936.

Black Custom High-Power Semiconductor / Power Electronics Fin Aluminum Heat Sink Open Details in New Window [Mar 03, 2025]

Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...

Company: Jiangsu Goldsun Winwin Global Trade Co., Ltd.

Custom Small High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink
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13937.

Custom Small High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink Open Details in New Window [Mar 03, 2025]

Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...

Company: Jiangsu Goldsun Winwin Global Trade Co., Ltd.

Black Custom High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink
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13938.

Black Custom High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink Open Details in New Window [Mar 03, 2025]

Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...

Company: Jiangsu Goldsun Winwin Global Trade Co., Ltd.

Specializes in The Production of Dust-Free Ovens, Semiconductor Ovens, High-Temperature Ovens, ...
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13939.

Specializes in The Production of Dust-Free Ovens, Semiconductor Ovens, High-Temperature Ovens, ... Open Details in New Window [Mar 03, 2025]

Other Specification Heating mode 26kw 780L × 1 branch Model structure Single door design, the control box is located above the machine Insulation material The use of insulation cotton, six-sided ...

Company: Kunshan Fanqi Machinery Co., LTD

Wafer Dicing Saw for Semiconductor Industry Higher Movement Accuracy High Precision Dicing Machine
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13940.

Wafer Dicing Saw for Semiconductor Industry Higher Movement Accuracy High Precision Dicing Machine Open Details in New Window [Feb 28, 2025]

Product Description It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of feed ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Residue Removal Debonding Machine Manufacture and Test with Imported Advanced ...
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13941.

Semiconductor Residue Removal Debonding Machine Manufacture and Test with Imported Advanced ... Open Details in New Window [Feb 28, 2025]

Product Description features Automatic glue removeralso known as Flush runner residual glue machine and semiconductor strippers; 1. Equipment function: one-time punching (removal) of the gate runner of the product ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Pipe Welding Machine Tube Orbital Welding Machine for S S Pipe, Food, Semiconductor ...
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13942.

Automatic Pipe Welding Machine Tube Orbital Welding Machine for S S Pipe, Food, Semiconductor ... Open Details in New Window [Feb 27, 2025]

I. Closed Tube and Tube Welding Torch I.PRODUCT DESCRIPTION This welding gun is a special welding gun designed and developed for all position automatic welding of various pipe fittings. I.PRODUCT ...

Company: Wincoo Engineering Co., Ltd.

Xd20W Automatic Pipe Welding Machine Tube Orbital Welding Machine for S S Pipe, Food, Semiconductor ...
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13943.

Xd20W Automatic Pipe Welding Machine Tube Orbital Welding Machine for S S Pipe, Food, Semiconductor ... Open Details in New Window [Feb 27, 2025]

I. Closed Tube and Tube Welding Torch I.PRODUCT DESCRIPTION This welding gun is a special welding gun designed and developed for all position automatic welding of various pipe fittings. I.PRODUCT ...

Company: Wincoo Engineering Co., Ltd.

Wafer Size 6"- 8" Customized High Precision Semiconductor Die Bonder Die Bonding Machine for IC ...
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13944.

Wafer Size 6"- 8" Customized High Precision Semiconductor Die Bonder Die Bonding Machine for IC ... Open Details in New Window [Feb 26, 2025]

Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

China Factory Price Pi Curing Oxygen-Free Oven for Semiconductor Manufacturing/COB Packaging
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13945.

China Factory Price Pi Curing Oxygen-Free Oven for Semiconductor Manufacturing/COB Packaging Open Details in New Window [Feb 25, 2025]

Product Description PI curing oxygen-free oven PI curing oxygen-free oven is used for special process requirements of PI, BCB, LCP curing and baking, photoresist curing, and electronic ceramic material drying. It is ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Trim & Form System Semiconductor Equipment for Product Cutting/ Bending/Forming/Separation After ...
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13946.

Trim & Form System Semiconductor Equipment for Product Cutting/ Bending/Forming/Separation After ... Open Details in New Window [Feb 25, 2025]

Product Description Main Features Equipment function: product cutting, bending, forming, and separation after plastic sealing; Applicable packaging: SOP/SSOP and other series; Punching power: servo motor upper power ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Automatic Chip Laying Machine for Semiconductor IC Packaging Production
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13947.

Semiconductor Automatic Chip Laying Machine for Semiconductor IC Packaging Production Open Details in New Window [Feb 25, 2025]

Product Description Main Features Equipment function: Using a robotic arm to automatically grasp and discharge the lead frame; Applicable packaging: all packaging; Control system: PLC (Omron) Operating system: ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Strippers Equipment with Double Switch Protection/Emergency Stop Button Device
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13948.

Semiconductor Strippers Equipment with Double Switch Protection/Emergency Stop Button Device Open Details in New Window [Feb 25, 2025]

Product Description features Automatic glue removeralso known as Flush runner residual glue machine and semiconductor strippers; 1. Equipment function: one-time punching (removal) of the gate runner of the product ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Auto Molding Equipment with Servo Control System, PLC (Omron) +Controller
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13949.

Semiconductor Auto Molding Equipment with Servo Control System, PLC (Omron) +Controller Open Details in New Window [Feb 25, 2025]

Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 inch touch screen+touch ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Nitrogen-Filled Oxygen-Free Ovens Semiconductor Equipment with Controllable Heating Rate
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13950.

Nitrogen-Filled Oxygen-Free Ovens Semiconductor Equipment with Controllable Heating Rate Open Details in New Window [Feb 25, 2025]

Product Description PI curing oxygen-free oven PI curing oxygen-free oven is used for special process requirements of PI, BCB, LCP curing and baking, photoresist curing, and electronic ceramic material drying. It is ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.