Jiangsu Profile
Product List
13741. Custom High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink 
[Mar 03, 2025]
[Mar 03, 2025] Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...
13742. Affordable Dust-Free Oven, Semiconductor Oven, High Temperature Oven, etc. [Mar 03, 2025]
[Mar 03, 2025] Other Specification Heating mode 26kw 780L × 1 branch Model structure Single door design, the control box is located above the machine Insulation material The use of insulation cotton, six-sided ...
Company: Kunshan Fanqi Machinery Co., LTD
13743. Customizable Non-Standard Dust-Free Ovens, Semiconductor Ovens, High-Temperature Ovens, etc. [Mar 03, 2025]
[Mar 03, 2025] Other Specification Heating mode 26kw 780L × 1 branch Model structure Single door design, the control box is located above the machine Insulation material The use of insulation cotton, six-sided ...
Company: Kunshan Fanqi Machinery Co., LTD
13744. Purity Customize Rectangle Frosty Fused Silica Wafer Quartz Glass Plate for Semiconductor [Feb 28, 2025]
[Feb 28, 2025] Customize Rectangle Frosty Fused Silica wafer Quartz Glass Plate for semiconductor: The adavantage of frosty fused quartz glass plate is not easy to be corroded, can withstand high temperature, beautiful appearance, ...
13745. Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China [Feb 26, 2025]
[Feb 26, 2025] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...
13746. Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
13747. China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports ...
13748. High Precision Semiconductor Chip Eutectic Wafer Turret Loading and Unloading Machine [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
13749. Automatic Die Bonder Qfn Dfn Upload and Down Load Semiconductor Equipment [Feb 25, 2025]
[Feb 25, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
13750. High End Die Attach Bonder Equipment to Assist in Semiconductor Packaging [Feb 25, 2025]
[Feb 25, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
13751. High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment [Feb 25, 2025]
[Feb 25, 2025] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
13752. Aerospace-Grade Stainless Steel CNC Turning China Spare Parts and Accessories Machining Centre ... [Feb 20, 2025]
[Feb 20, 2025] Product Description Product Processing Type CNC Turning, CNC Milling, Laser Cutting, Bending, Spinning, Wire Cutting, Stamping, Electric Discharge Machining (EDM), Injection Molding Materials Stainless steel: ...
13753. EGH25CA EGR25 HXHV Lm Guide Block for Semiconductor Manufacturing Equipment [Feb 10, 2025]
[Feb 10, 2025] Model Number H (mm) W (mm) B (mm) L (mm) G (mm) WR (mm) Block Weight (kg) Rail ...
Company: Wuxi HXH Bearing Co., Ltd.
13754. EGH25SA HGR25 HXVH Linear Slide Bearing for Semiconductor Manufacturing Equipment [Feb 10, 2025]
[Feb 10, 2025] Model Number H (mm) W (mm) B (mm) L (mm) G (mm) WR (mm) Block Weight (kg) Rail ...
Company: Wuxi HXH Bearing Co., Ltd.
13755. EGW30SA EGR30 HXHV Linear Rail System for Semiconductor Manufacturing Equipment [Feb 10, 2025]
[Feb 10, 2025] Model Number H (mm) W (mm) B (mm) L (mm) G (mm) WR (mm) Block Weight (kg) Rail ...
Company: Wuxi HXH Bearing Co., Ltd.
