Jiangsu Profile
Product List
13726. Ultra High Purity Gas Metal Face Seal Gasket Fitting Long Reducing Tee for Semiconductor and Vacuum 
[May 10, 2025]
[May 10, 2025] NAI-LOK is the leader in flow control technology fields of manufacturers. NAI-LOK`s target is challenge and beyond the technical limits, continuing pursuit becoming the industry leader. Since the establishment, we ...
13727. Mechanical Polishing Surface 6" 8" 12" High Quality Custom Dura420 SUS420J2 Materials Wafer Frame ... [Apr 02, 2025]
[Apr 02, 2025] Mechanical Polishing Surface 6" 8" 12" High Quality Custom Dura420 SUS420J2 Materials Wafer Frame Dicing Ring for Semiconductor Product Description Product Name 6" 8" 12" steel Metal Wafer Frame Ring For ...
Company: Wuxi Jinbao Special Steel Co., Ltd.
13728. Premium Silane Gas by Kaimei for Advanced Semiconductor Solutions [Apr 01, 2025]
[Apr 01, 2025] Product Description Silane is a colorless, reacting with air and can cause choking gas. The gas is usually caused by contact with air, it will burn and emit a very strong white amorphous silica smoke. The primary ...
13729. Zyx 3m FC-3283 44lb Electronic Liquid Semiconductor Coolant Electrical Equipment Cleaning Agent [Mar 31, 2025]
[Mar 31, 2025] 3M FC3283 Product Description 3M Fluorinert FC-3283 Electronic Liquid 5 KG is a clear, colorless, thermally stable, liquid ideal for use in many single-phase heat transfer applications in the semiconductor ...
Company: Jingjiang E-Asia Bearing Co., Ltd.
13730. Alpha-335g Metallographic Slice Sand and Polish Semiconductor Chip Grinding and Polishing Machine ... [Mar 27, 2025]
[Mar 27, 2025] Model Alpha-335G Grinding stone Size Ø350xØ32x45mm Speed 100-1500rpm Rotation direction Counterclockwise Motor power (S1) 4.0kw Sample clamping disc Clamping disc diameter 160mm, maximum ...
13731. High End Semiconductor Wafer Saw Machine [Mar 25, 2025]
[Mar 25, 2025] High End Semiconductor Wafer Saw Machine Product Description It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of ...
13732. Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment [Mar 19, 2025]
[Mar 19, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
13733. Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment [Mar 19, 2025]
[Mar 19, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
13734. Semiconductor Bonding Equipment High Precision Wafer Placement Accuracy Die Bonder Machine [Mar 19, 2025]
[Mar 19, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
13735. Continuous Automated Production Semiconductor Sic Composite Coating Vertical Furnace Integrated ... [Mar 19, 2025]
[Mar 19, 2025] Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...
13736. Full-Automatic ID Sawing Machine for Silicon Wafer/Glass/Ceramics/GaAs/GaN/Semiconductor [Mar 19, 2025]
[Mar 19, 2025] Product Description It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of feed ...
13737. Electronical Grade 99.9999% Silane Gas Specialty Gas Sih4 for Semiconductor Industry and Chip ... [Mar 04, 2025]
[Mar 04, 2025] Product Description Essential details CAS No.: Other Names: 7803-62-5 Silane MF: EINECS No.: SiH4 232-263-4 Place of Origin: Grade Standard: Jiangsu, China Industrial Grade, Electron ...
Company: Jiangsu Huazhong Gas Co., Ltd.
13738. Custom High-Power Semiconductor / Power Electronics Black Fin Aluminum Heat Sink [Mar 03, 2025]
[Mar 03, 2025] Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...
13739. OEM High-Power Semiconductor / Power Electronics Black Fin Aluminum Heat Sink [Mar 03, 2025]
[Mar 03, 2025] Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...
13740. Custom High-Power Semiconductor and Power Electronics Fin Aluminum Heat Sink [Mar 03, 2025]
[Mar 03, 2025] Product Description Product Name Aluminum Alloy heat sink Raw Material aluminum or copper Surface treatment Zinc,Nickel,Silver,Golden,Tin-plated, Galvanized (Various of color), dacromet, blackened, ...
