Made-in-china.com

Made-in-Jiangsu.com

Home » Featured Products »

Semiconductor

» Jiangsu Product List

Product List

Versatile Fiber Laser Engraver for Personalized Logo Creation
Contact Now

9346.

Versatile Fiber Laser Engraver for Personalized Logo Creation Open Details in New Window [Sep 29, 2026]

Engraving Marker Logo Fiber Laser Marking Machine Product Description Brief Description Fiber Laser mainly applicable to metal materials, partial plastic materials and coated non-metal materials by high-speed flight ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Seamless Steel N2o Gas Tank - Nitrous Oxide with Cga326 Valve
Contact Now

9347.

Seamless Steel N2o Gas Tank - Nitrous Oxide with Cga326 Valve Open Details in New Window [Oct 21, 2026]

Product Description Specification CAS No 10024-97-2 EINECS No. 233-032-0 UN No. UN1070 Purity 99.9995% Dot Class 2.2 Grade Standard Electronic Grade, semiconductor Grade, Medical Grade Specification 99.9% 99.999% NO/NO2 ...

Company: Jiangsu Kaimei Electronic Materials Co., Ltd.

Precision Wafer Grinding Systems for Superior Production Output
Contact Now

9348.

Precision Wafer Grinding Systems for Superior Production Output Open Details in New Window [Sep 28, 2026]

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Precision Laser Cutting Systems for FPCB Manufacturing
Contact Now

9349.

Advanced Precision Laser Cutting Systems for FPCB Manufacturing Open Details in New Window [Sep 28, 2026]

High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision 15W UV Laser Dicing Tool for Wafer Processing
Contact Now

9350.

High Precision 15W UV Laser Dicing Tool for Wafer Processing Open Details in New Window [Sep 28, 2026]

Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Drilling Equipment for Enhanced Production Efficiency
Contact Now

9351.

Advanced Laser Drilling Equipment for Enhanced Production Efficiency Open Details in New Window [Sep 28, 2026]

Tgv High-End Precision Laser Drilling Machine Tgv industrial equipment factory supplier Product Description New Fully Automated Dual-Station Laser Cutter Sets Benchmark for Brittle Material Processing We are pleased to ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fiber Laser Engraver for High Precision Packaging Solutions and Custom Designs
Contact Now

9352.

Fiber Laser Engraver for High Precision Packaging Solutions and Custom Designs Open Details in New Window [Oct 19, 2026]

Online Flying Fiber Laser Marking Machine for Flexible Packaging Films Product Description Brief Description CO2 series products are mainly applicable to non-metallic materials of high-speed flight marking, such as ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision CO2 Laser Engraver for Wood and Plastic Crafting Machine
Contact Now

9353.

Precision CO2 Laser Engraver for Wood and Plastic Crafting Machine Open Details in New Window [Oct 19, 2026]

Product Description It can be widely used in graphic marks on craft gifts, clothing leather, wood paper, food packaging, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced UV Laser Cutter for Precision Semiconductor Wafer Processing Equipment
Contact Now

9354.

Advanced UV Laser Cutter for Precision Semiconductor Wafer Processing Equipment Open Details in New Window [Oct 19, 2026]

High Precision UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision 15W UV Laser Cutter for Wafer Manufacturing Applications
Contact Now

9355.

High-Precision 15W UV Laser Cutter for Wafer Manufacturing Applications Open Details in New Window [Oct 19, 2026]

Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing Features: 1. With 355nm UV laser, the cutting machine has stable performance, good light spot, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Roll-Sheet Laser Cutting Machine Precision 3c Roll Sheet Cutting
Contact Now

9356.

Roll-Sheet Laser Cutting Machine Precision 3c Roll Sheet Cutting Open Details in New Window [Sep 24, 2026]

Picosecond Laser Machinewith Double-Sation for Roll-Sheet Fast Micro-Processing Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Roll-Sheet Laser Cutting Machine Curved Flexible Display Panel Cut
Contact Now

9357.

Roll-Sheet Laser Cutting Machine Curved Flexible Display Panel Cut Open Details in New Window [Sep 24, 2026]

Picosecond Laser Machinewith Double-Sation for Roll-Sheet Fast Micro-Processing Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Roll-Sheet Laser Cutting Machine Flexible Circuit Roll Scribing
Contact Now

9358.

Roll-Sheet Laser Cutting Machine Flexible Circuit Roll Scribing Open Details in New Window [Sep 24, 2026]

Picosecond Laser Machinewith Double-Sation for Roll-Sheet Fast Micro-Processing Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Roll-Sheet Laser Cutting Machine 3c Flexible Circuit Precision Cut
Contact Now

9359.

Roll-Sheet Laser Cutting Machine 3c Flexible Circuit Precision Cut Open Details in New Window [Sep 24, 2026]

Picosecond Laser Machinewith Double-Sation for Roll-Sheet Fast Micro-Processing Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Roll-Sheet Laser Cutting Machine Dual Worktable Roll Processing
Contact Now

9360.

Roll-Sheet Laser Cutting Machine Dual Worktable Roll Processing Open Details in New Window [Sep 24, 2026]

Picosecond Laser Machinewith Double-Sation for Roll-Sheet Fast Micro-Processing Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.