Jiangsu Profile
Product List
9286. Advanced Automated Wafer Handling System for Maximum Efficiency 
[Oct 09, 2026]
[Oct 09, 2026] Product Description The Wafer Automatic Transfer System is a precision robotic manipulator designed for semiconductor manufacturing, wafer handling, and vacuum process automation. It ensures high-speed, high-precision, ...
9287. Advanced Fiber Laser Cutter for Precision Manufacturing Excellence [Oct 09, 2026]
[Oct 09, 2026] High-Quality Fiber Laser Cutting Equipment with High Reliability and User-Friendly Operation Product Description MPS-0806D is a small-format fiber laser cutting machine with international standards specially ...
9288. Precision Laser Cutting Systems for Semiconductor Production Efficiency [Oct 09, 2026]
[Oct 09, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
9289. High Precision Laser Dicer for IC Glass and Ceramics [Oct 09, 2026]
[Oct 09, 2026] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
9290. Versatile 5W Portable Marker for Bottles and Pipe Labeling [Oct 09, 2026]
[Oct 09, 2026] Product Description Brief Description UV series products can be used on most materials on normal 3rd level flight marking, especially useful on materials like: plastic, PE Bottle, package bag, PVC pipe line, etc. ...
9291. Advanced Precision Laser Marking for Automotive PCBA Parts [Oct 09, 2026]
[Oct 09, 2026] Fast Speed / High Response Large Format PCBA Laser Marking Machine for Automotive Circuits Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. ...
9292. Versatile Laser Engraving Tool for PCB Design Success [Sep 30, 2026]
[Sep 30, 2026] High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA ...
9293. Precision Laser Marking System for High-Quality Wafer Solutions [Sep 30, 2026]
[Sep 30, 2026] High Standard UV Laser Marking Machine for Food, PVC Pipe, Medicine Packaging Material Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of ...
9294. Precision Laser Marking Solutions for Electronic Parts and Components [Sep 30, 2026]
[Sep 30, 2026] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...
9295. High-Precision CO2 Laser Engraver for Creative Art Projects [Sep 29, 2026]
[Sep 29, 2026] Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...
9296. Versatile Fiber Laser Engraver for Personalized Logo Creation [Sep 29, 2026]
[Sep 29, 2026] Engraving Marker Logo Fiber Laser Marking Machine Product Description Brief Description Fiber Laser mainly applicable to metal materials, partial plastic materials and coated non-metal materials by high-speed flight ...
9297. Seamless Steel N2o Gas Tank - Nitrous Oxide with Cga326 Valve [Oct 21, 2026]
[Oct 21, 2026] Product Description Specification CAS No 10024-97-2 EINECS No. 233-032-0 UN No. UN1070 Purity 99.9995% Dot Class 2.2 Grade Standard Electronic Grade, semiconductor Grade, Medical Grade Specification 99.9% 99.999% NO/NO2 ...
9298. Precision Wafer Grinding Systems for Superior Production Output [Sep 28, 2026]
[Sep 28, 2026] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
9299. Advanced Precision Laser Cutting Systems for FPCB Manufacturing [Sep 28, 2026]
[Sep 28, 2026] High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, ...
9300. High Precision 15W UV Laser Dicing Tool for Wafer Processing [Sep 28, 2026]
[Sep 28, 2026] Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...
